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5 дней назад

Process Development Engineer (Thin Film)

95 526 - 123 366$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Process Development Engineer (Thin Film) (Vacuum Thin Film Technology): Leading process and application development for ion beam deposition and etch technologies, with an accent on advanced thin film processes, experimentation, and customer requirements. Focus on designing and analyzing experiments, developing process-control methods, characterizing thin films, and coordinating hardware upgrades for semiconductor applications.

Location: On-site at a manufacturing partner's facility in Beverly, Massachusetts, United States

Salary: $95,526–$123,366 per year, plus a bonus opportunity

Company

hirify.global designs, develops, manufactures, and services advanced equipment used to produce devices for smartphones, cloud computing, wireless communications, artificial intelligence, augmented and virtual reality, and other digital technologies.

What you will do

  • Lead process and application development using ion beam deposition and etch technologies.
  • Manage advanced thin film process development, including experiment design, execution, and data analysis.
  • Develop and maintain best-known methods for process control, development, and continuous improvement.
  • Work with customers as a technical expert and support technical partnerships with key accounts.
  • Collaborate with Sales and Marketing to define process specifications for hirify.global tools.
  • Coordinate with Engineering on new hardware and equipment upgrades for deposition and etch technologies.

Requirements

  • Bachelor's degree with at least 5 years of related experience, or a master's degree with 3+ years of experience, or a PhD in Physics, Materials Science, or a related field.
  • Process development experience and expertise with vacuum thin film technology.
  • Expertise in thin film characterization techniques, including four-point probe, stress measurements, ellipsometry, absorption/transmission spectroscopy, XRD/XRR, and depth profiling.
  • Knowledge of semiconductor devices, module processes, and process integration in logic and/or memory fabrication.
  • Strong interpersonal and communication skills, a collaborative attitude, and the ability to work with change and ambiguity.
  • Ability to travel up to 25% domestically and internationally.

Nice to have

  • Experience with metal thin films.
  • Background in metal and semiconductor thin film technologies.

Culture & Benefits

  • Medical, dental, and vision insurance.
  • 401(k) with company match.
  • Holiday, vacation, and sick time.
  • Flexible spending accounts and commuter benefits.
  • Life, accident, and disability insurance, plus emergency travel assistance.
  • Tuition reimbursement and an employee assistance program.

Hiring process

  • Multiple interviews with several team members, conducted in person or virtually.
  • References or a background investigation may be conducted before an offer.

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