Staff Process Engineer, Dry Etch (Semiconductor Manufacturing)

Location: Hybrid role based at an hirify.global site in Hillsboro, Oregon, or Phoenix, Arizona, United States; on-site presence is required as part of the hybrid model.

Salary: $133,800–$255,200 USD annual salary, depending on location, skills, experience, and education.

Company

hirify.global Foundry develops and manufactures advanced semiconductor process and packaging technologies for global foundry customers.

What you will do

• Drive technology development initiatives supporting high-volume manufacturing and future process nodes, including hirify.global 18A.
• Develop process integration and equipment solutions, conduct feasibility studies, and design manufacturing processes.
• Optimize materials, process parameters, equipment metrology, and system designs to improve production output.
• Partner with equipment and materials suppliers to develop and customize dry etch technology.
• Support yield improvement, defect reduction, new product introduction, tape-out troubleshooting, and manufacturing ramps.
• Mentor technical leaders and influence process technology direction across hirify.global and the supplier ecosystem.

Requirements

• Bachelor's degree in Electrical Engineering, Physics, Materials Science, or a related STEM field.
• 4+ years of relevant semiconductor industry experience focused on dry etch modules.
• Experience in process development, semiconductor process engineering, materials, leadership, or related areas.
• Experience working with dry etch tool suppliers, including Lam Research, TEL, Applied Materials, or Hitachi.
• Extensive fab experience with a technical record in research and development, yield improvement, or defect reduction.
• Experience with process data analysis, root cause analysis, solution development, or Design of Experiment principles.

Nice to have

• Advanced degree in Electrical Engineering, Physics, Materials Science, or a related STEM field.
• Foundry dry etch development experience across FEOL, MOL, or BEOL.
• Hands-on experience with sub-3nm Gate-All-Around FETs.
• Experience with factory automation, high-volume manufacturing, device parametric data, industry standards, and certifications.
• Experience with foundry NPI activities and complex tape-out troubleshooting.

Culture & Benefits

• Collaborative work with Logic Technology Development and Technology and Foundry Supply Manufacturing teams.
• Opportunity to work on advanced semiconductor manufacturing technologies and foundry customer solutions.
• Hybrid work model combining on-site work at an assigned hirify.global site with off-site work.
• Compensation package including stock bonuses, health benefits, retirement benefits, and vacation.