Process Engineer (Plasma Etch)

Location: Albany, New York, United States. The role operates in an office setting and requires 4–6 hours per day at a computer.

Salary: $67,979.86–$96,098.86 per year.

Company

hirify.global develops and supports semiconductor manufacturing equipment and process technologies through TEL Technology Center, America, LLC.

What you will do

• Develop, modify, and optimize plasma etch process formulations for pilot and production environments.
• Define equipment requirements and assess processing methods for compatibility, efficiency, and scalability.
• Compile and analyze test data to establish process limits, variables, and control strategies.
• Troubleshoot process deviations and collaborate with design engineering, R&D, manufacturing, and quality teams.
• Evaluate automation, materials, and new technologies for process improvement.
• Lead complex projects, mentor junior engineers, and contribute to process engineering standards.

Requirements

• Bachelor’s degree in engineering, Chemistry, Materials Science, or a related field.
• Process Engineer I: no experience required; relevant experience or internships are preferred.
• Process Engineer II: 2 years of relevant experience.
• Process Engineer III: 5 years of relevant experience.
• Knowledge of semiconductor or hardware manufacturing processes, process development, data analysis, and statistical process control.
• For higher levels: experience with design of experiments, advanced process control, project leadership, cross-functional collaboration, and mentoring.

Culture & Benefits

• Full-time employment with a comprehensive benefits package for regular full-time employees.
• Eligibility for bonus plans and long-term incentives may apply to certain roles.
• Work includes collaboration across engineering, scientific, R&D, manufacturing, and quality groups.
• Physical requirements include occasional lifting of office products and supplies up to 35 pounds.