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6 часов назад

Director, Advanced Product Engineering (Thermal Management)

192 400 - 252 525$
Формат работы
onsite
Тип работы
fulltime
Грейд
director
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Director, Advanced Product Engineering (Thermal Management): Leading the development and delivery of advanced cooling solutions for probe card technologies with an accent on thermal architecture, temperature uniformity, and thermal stability. Focus on defining multi-year technology roadmaps, scaling engineering teams, and solving complex product, manufacturing, reliability, and customer challenges in semiconductor test systems.

Location: Livermore, California, United States; full-time day shift

Salary: $192,400–$252,525 per year, plus quarterly profit-sharing bonuses

Company

hirify.global provides test and measurement technologies for the semiconductor product life cycle, serving customers through facilities across Asia, Europe, and North America.

What you will do

  • Lead the architecture, design, and development of advanced cooling solutions for probe card technologies.
  • Define the thermal technology strategy and multi-year roadmap aligned with product and business objectives.
  • Lead, develop, and scale an engineering team while managing resources, priorities, and organizational design.
  • Establish engineering and business KPIs and manage development programs using Product Life Cycle methodology.
  • Develop concepts for heat removal, temperature uniformity, and thermal stability, including prototypes and alpha and beta probe cards.
  • Drive resolution of critical product and customer issues and deliver complex programs against schedule, cost, manufacturability, reliability, and technical performance goals.

Requirements

  • 12+ years of relevant leadership experience with a bachelor’s degree, or 10 years with a master’s degree, or 8 years with a PhD, or equivalent experience.
  • 10+ years of relevant experience in thermal management, electronics cooling, semiconductor equipment, or advanced product development.
  • Demonstrated success leading engineering teams in semiconductor, electronics cooling, or related industries.
  • Experience with thermal management, heat transfer, computational fluid dynamics, FEA, thermomechanical processing, and product development.
  • Proficiency with 3D modeling, AutoCAD 3D, GD&T, MATLAB, Python, and SolidWorks.
  • Strong business acumen, communication, problem-solving, and cross-functional leadership skills.

Culture & Benefits

  • Values include customer focus, ownership and accountability, respectful communication, and people development.
  • Medical, dental, vision, life insurance, and disability coverage.
  • 401(k) with company match and employee stock purchase plan.
  • Paid time off and flexible spending or savings accounts.
  • Quarterly profit-sharing bonuses.

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