Advanced Packaging Photolithography Development Engineer (Semiconductor)

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $133,800–$188,890 USD

Company

hirify.global develops semiconductor technologies and advanced packaging solutions.

What you will do

• Qualify scanner, stepper, and track platforms for backend and hybrid bonding lithography applications.
• Develop, characterize, and optimize photolithography processes for Cu damascene pads, dielectric vias and trenches, bonding interface layers, and alignment marks.
• Evaluate underlayer stacks and address topography challenges in backend and packaging substrates.
• Develop overlay metrology, advanced process control, and run-to-run and lot-to-lot feedback/feedforward strategies.
• Collaborate with process integration, equipment, metrology, design, and supplier teams to build integrated process flows and evaluate next-generation tools and materials.
• Perform defect analysis and root-cause investigations to improve lithography-related yield detractors and support technology roadmap planning.

Requirements

• Master’s degree in materials science, mechanical, chemical, or electrical engineering, physics, chemistry, or a related field with 3+ years of relevant experience; or a PhD with 2+ years of relevant experience.
• Hands-on semiconductor-fab lithography process development experience with i-line, KrF, or ArF.
• Experience optimizing photoresist coating, baking, developing, resist profiles, and process windows.
• Strong knowledge of aerial image formation, resist chemistry, focus-exposure matrices, depth of focus, and exposure latitude.
• Proficiency in statistical process control and design of experiments.
• Ability to work on-site in Hillsboro, Oregon, United States.

Nice to have

• Advanced packaging lithography experience with hybrid bonding, Foveros, fan-out WLP, 2.5D/3D IC, CoWoS, SoIC, or equivalent technologies.
• Experience with packaging processes, equipment automation, or project management in technology development.
• Experience with overlay metrology and control, CDSEM, and OCD/scatterometry.
• Strong analytical skills and experience conducting root-cause analysis for complex process issues.

Culture & Benefits

• Full-time experienced-hire position on Shift 1.
• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Cross-functional work on next-generation semiconductor packaging technology.
• Commitment to ethical hiring and responsible business practices; no recruitment or employment fees are charged.