Process Engineer – Die to Wafer Hybrid Bonding

Location: Santa Clara, California, United States; onsite work at the Santa Clara headquarters. Relocation eligible.

Salary: $147,000–$202,500 per year

Company

hirify.global develops and services materials engineering equipment used in semiconductor and advanced display manufacturing.

What you will do

• Develop die-to-wafer hybrid bonding processes for advanced 2.5D/3D packaging.
• Develop surface preparation, plasma activation, high-accuracy die placement and alignment processes.
• Perform post-bond characterization, process evaluation and film-property measurements.
• Integrate bonding with dicing, die preparation, die thinning, inter-die gap fill and planarization.
• Design and execute DOE-driven experiments to evaluate process limits, sensitivities and trade-offs.
• Optimize processes, perform failure analysis and drive continuous engineering improvements while collaborating with R&D teams, vendors, suppliers and customers.

Requirements

• Ph.D. or M.S. in Materials Science, Electrical Engineering, Applied Physics or a related STEM discipline.
• Hands-on experience with die-to-wafer or wafer-to-wafer hybrid bonding, thin-die handling and alignment, micro-LED, CPO, heterogeneous integration or semiconductor process equipment.
• Strong understanding of bond-interface physics, alignment and overlay fundamentals, and the mechanical behavior of thin and fragile dies.
• Proficiency in statistical analysis and process control, including DOE, SPC and JMP.
• Strong problem-solving, communication and collaboration skills; able to work independently with minimal supervision.

Culture & Benefits

• Hands-on training with state-of-the-art equipment, including an integrated die-to-wafer hybrid bonding system.
• Work with a cross-functional research team and R&D groups on semiconductor and display technologies.
• Supportive environment focused on learning, professional development and innovation.
• Comprehensive benefits package with potential bonus and stock award eligibility.
• Travel up to 10% of the time.