Process Engineer (Die to Wafer Hybrid Bonding)

Location: Santa Clara, CA; onsite work at the Santa Clara headquarters; travel required up to 10% of the time; relocation eligible.

Salary: $147,000.00–$202,500.00 per year.

Company

hirify.global develops materials engineering solutions and equipment used in semiconductor and display manufacturing, including technologies for advanced packaging.

What you will do

• Develop die-to-wafer hybrid bonding processes, including surface preparation, plasma activation, high-accuracy die placement and alignment, and post-bond characterization.
• Integrate die-to-wafer bonding with dicing and die preparation, die thinning, inter-die gap fill, and planarization modules.
• Design and execute DOE-driven experiments to evaluate process limits, sensitivities, and trade-offs.
• Optimize processes, perform failure analysis and characterization, and drive continuous engineering improvements.
• Collect and analyze data, characterize hardware, troubleshoot engineering issues, measure film properties, and generate technical documentation.
• Collaborate with customers, vendors, suppliers, and multidisciplinary R&D teams on advanced packaging technology development.

Requirements

• Ph.D. or M.S. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.
• In-depth knowledge and hands-on experience in one or more of the following: die-to-wafer or wafer-to-wafer hybrid bonding; thin die handling and alignment-critical processes; Micro-LED or CPO; heterogeneous integration such as III-V to silicon or novel materials to silicon 2.5D/3D integration; or direct process engineering on mainstream semiconductor equipment such as plasma, wet clean, or overlay/alignment systems.
• Strong understanding of bond interface physics, alignment and overlay fundamentals, and the mechanical behavior of thin and fragile dies.
• Proficiency in statistical analysis and process control, including DOE, SPC, and JMP.
• Strong problem-solving skills and the ability to work independently and collaboratively with minimal supervision.
• Strong communication and interpersonal skills for effective collaboration across multidisciplinary teams.

Culture & Benefits

• Hands-on training and experience with state-of-the-art equipment, including a fully integrated die-to-wafer hybrid bonding system.
• Opportunity to collaborate with R&D teams on 2.5D/3D advanced packaging research and development.
• Supportive work culture focused on learning, development, and career growth.
• Comprehensive employee health and wellbeing programs and benefits.
• Eligible candidates may receive bonus and stock award compensation, as applicable.