Principal Process Engineer (Microelectronics Packaging)

Location: Tempe, Arizona, United States; onsite work is expected 4 days per week.

Salary: $128,800–$193,200 per year in U.S. locations excluding Puerto Rico and specific California locations.

Company

hirify.global develops healthcare technologies intended to alleviate pain, restore health, and extend life.

What you will do

• Develop and transfer microelectronic packaging processes for printed circuit board assembly and wafer-level packaging into manufacturing.
• Support underfill dispense, pick-and-place, solder paste dispense, reflow, epoxy cure, cleaning, laser cutting, and automated inspection processes.
• Evaluate materials, equipment, tooling, fixtures, process inputs, outputs, and alignment with manufacturing requirements.
• Perform equipment qualifications, process validations, measurement system studies, and gage R&R analyses.
• Monitor process output, investigate root causes, resolve yield and production issues, and provide sustaining engineering support.
• Maintain quality-system documentation and ensure processes comply with applicable regulations.

Requirements

• Bachelor's degree with at least 7 years of relevant experience, or a master's degree with at least 5 years, or a PhD with at least 3 years.
• Experience developing manufacturing processes and applying statistical methods to process improvement.
• For bachelor's degrees earned outside the United States, the degree must satisfy the requirements of 8 C.F.R. § 214.2(h)(4)(iii)(A).
• U.S. work authorization sponsorship is offered for Principal-level roles and above; sponsorship includes H-1B, TN, and J classifications.
• Ability to work onsite in Tempe 4 days per week and interact with manufacturing, design, and cross-functional teams.

Nice to have

• Advanced degree in mechanical engineering or materials science.
• Experience transferring processes from concept through manufacturing, preferably in a high-volume facility.
• DRM/DFSS, Lean Sigma, or Green/Black Belt Lean Sigma certification.
• Experience with DOE, Minitab or JMP, SPC, process capability analysis, and control charts.
• Experience programming and troubleshooting automated assembly, visual inspection, metrology, or laser-processing equipment.

Culture & Benefits

• Purpose-driven work focused on healthcare technology and patient outcomes.
• Health, dental, and vision insurance, plus HSA and healthcare FSA options for eligible regular employees.
• 401(k) plan with employer contribution and match, paid time off, paid holidays, and short- and long-term disability benefits.
• Tuition assistance, life insurance, dependent daycare spending account, employee stock purchase plan, and incentive plans.
• Short-term incentive eligibility through the hirify.global Incentive Plan.