Packaging Module Equipment Development Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States. US citizenship is required.

Salary: Annual salary range of $99,030–$188,890 USD.

Company

hirify.global develops and manufactures silicon products and advanced semiconductor packaging technologies.

What you will do

• Develop and optimize assembly processes and equipment against quality, reliability, cost, yield, productivity, and manufacturability goals.
• Apply Design of Experiments and statistical methods to refine processes, specifications, and equipment capabilities, and document findings in technical reports.
• Ensure package-layout manufacturability and manage equipment health and long-term reliability from development through high-volume manufacturing.
• Integrate new materials and architectures into manufacturing equipment for advanced foundry customer products.
• Develop techniques, tools, and quality screens to identify and address equipment health and reliability issues.
• Lead technical problem-solving, continuous improvement, equipment qualification standardization, and manufacturing quality initiatives aligned with product milestones.

Requirements

• US citizenship.
• Bachelor’s degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience; or a Master’s degree in one of these fields with 1+ years of relevant experience; or a PhD in one of these fields.
• Proficiency in Statistical Process Control and Design of Experiments principles.

Nice to have

• Ability to lead technical innovation and manage complex, time-sensitive projects.
• Experience with high-volume manufacturing, equipment troubleshooting, and change qualification.
• Understanding of semiconductor fabrication processes and packaging technologies.
• Familiarity with equipment installation and qualification.
• Experience optimizing procedures or designing for safety, quality, and cost-effective manufacturability.

Culture & Benefits

• On-site work model with Shift 1 in the United States.
• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Collaboration with cross-functional teams on advanced semiconductor manufacturing and packaging technologies.