Packaging Module Equipment Development Engineer (Semiconductor)

Location: On-site in Phoenix, Arizona, United States

Annual salary: $99,030–$188,890 USD

Company

hirify.global develops and manufactures silicon products and semiconductor technologies, including advanced assembly and packaging solutions.

What you will do

• Develop and optimize assembly processes and equipment for quality, reliability, cost, yield, productivity, and manufacturability targets.
• Apply Design of Experiments and statistical methods to refine processes, specifications, and equipment capabilities.
• Evaluate package design layouts for manufacturability and manage equipment health and reliability from development through high-volume manufacturing.
• Integrate new materials and architectures into manufacturing equipment for advanced foundry products.
• Develop tools, techniques, and quality screens to identify equipment health and reliability issues.
• Lead technical problem-solving, continuous improvement, equipment qualification, and manufacturing quality initiatives.

Requirements

• US citizenship required.
• Bachelor’s degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field plus 2+ years of relevant experience; or a master’s degree plus 1+ year; or a PhD in a related field.
• Proficiency in Statistical Process Control and Design of Experiments principles.
• Experience with high-volume manufacturing, equipment troubleshooting, change qualification, or equipment installation and qualification is preferred.
• Knowledge of semiconductor fabrication processes, packaging technologies, and design for safe, high-quality, cost-effective manufacturability is preferred.

Culture & Benefits

• On-site work model supporting US-based manufacturing.
• Competitive pay with potential stock bonuses.
• Health, retirement, and vacation benefits.
• Collaboration with cross-functional teams on advanced semiconductor technologies.