ATD MIHL Equipment Development Engineer (Semiconductors)

TL;DR

ATD MIHL Equipment Development Engineer (Semiconductors): Designing and optimizing innovative packaging processes and equipment for next-generation semiconductor solutions with an accent on manufacturing efficiency, product reliability, and technological advancements. Focus on implementing DOE principles, designing evaluation equipment for simulated field conditions, and optimizing physical layouts for manufacturability.

Location: Phoenix, Arizona, US (On-site). This position is not eligible for hirify.global immigration sponsorship.

Salary: $115,110 - $188,890 USD

Company

hirify.global is a global leader in the semiconductor industry, specifically advancing assembly and packaging technologies to enable cutting-edge hardware solutions.

What you will do

• Develop and refine packaging processes and equipment to achieve quality, reliability, cost, and productivity targets.
• Apply Design of Experiments (DOE) and statistical methodologies to optimize processes and specifications.
• Design and maintain equipment to evaluate packaging technologies under simulated field conditions (heat, humidity, dynamic forces).
• Ensure manufacturability of physical layouts in package design and oversee manufacturing workflows.
• Collaborate with supplier quality and procurement teams to define material specifications and ensure compliance.
• Innovate new tools and quality screens to proactively mitigate packaging reliability challenges.

Requirements

• Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 3+ years of experience (or Master's with 2+ years / PhD with 6+ months).
• Must be authorized to work in the US; no immigration sponsorship available.
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Competency in mechanical design software such as SolidWorks or AutoCAD.
• Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing (GD&T).

Nice to have

• Understanding of semiconductor fabrication processes and packaging technologies.
• Experience with high-precision manufacturing methods, including stamping and CNC machining.
• Familiarity with supply chain management in a manufacturing or materials qualification environment.
• Proven ability to lead technical innovation and manage complex, time-sensitive projects.

Culture & Benefits

• Competitive total compensation package including base pay and stock bonuses.
• Comprehensive benefit programs including health insurance and retirement plans.
• Paid vacation and time off.
• Opportunity to work within a high-impact team shaping the future of assembly packaging technologies.