Packaging Module Equipment Development Engineer

TL;DR

Packaging Module Equipment Development Engineer (Semiconductor): Developing and optimizing assembly processes and equipment for future packaging platform technologies with an accent on quality, reliability, and manufacturability. Focus on applying statistical methods and design of experiments to solve complex failure mechanisms and ensure high-yield manufacturing.

Location: Must be based in Phoenix, Arizona (Onsite)

Salary: $115,110–$219,550 USD

Company

hirify.global is a global leader in semiconductor manufacturing, driving innovation in silicon process and advanced packaging technology for the AI era.

What you will do

• Develop assembly processes and equipment specifications to enable future packaging platform technologies.
• Optimize manufacturing efficiency to meet strict quality, reliability, cost, and yield requirements.
• Apply design of experiments and statistical analysis to improve equipment performance and process maturity.
• Establish material specifications and interface with vendors to ensure high-quality standards.
• Lead innovation and problem-solving efforts to address packaging failure mechanisms.
• Collaborate with cross-functional teams to standardize product qualification and manufacturing quality systems.

Requirements

• Bachelor's degree in Engineering, Physics, Chemistry or related STEM field with 6+ years of industry experience, or Master's with 3+ years, or PhD with 6+ months.
• Must be able to work onsite in Phoenix, Arizona.
• Experience with semiconductor fabrication processes and technology.
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Strong background in equipment selection, sustaining, and change control management.
• Proven ability to deliver results for time-critical technical projects.

Nice to have

• Hands-on experience with dispense, mold, and cure equipment technologies.
• Experience in technical innovation and complex project management.
• Background in quality data systems and semiconductor research.

Culture & Benefits

• Competitive total compensation package including base pay and stock bonuses.
• Comprehensive health and retirement benefit programs.
• Paid vacation and time-off policies.
• Opportunity to work on cutting-edge semiconductor technology in a global factory network.