Module Engineer (Semiconductor)

TL;DR

Module Engineer (Semiconductor): Developing and optimizing assembly processes and equipment for semiconductor packaging with an accent on manufacturing efficiency, quality, and reliability. Focus on implementing DOE and SPC principles, ensuring manufacturability of package designs, and establishing material specifications.

Location: On-site in Phoenix, Arizona, US. US Citizenship required.

Salary: $85,200–$162,500

Company

hirify.global is a global leader in semiconductor manufacturing and foundry services, delivering advanced packaging solutions for a broad ecosystem of customers.

What you will do

• Design and develop assembly processes and equipment for next-generation foundry packaging platforms.
• Optimize manufacturing efficiency focusing on quality, reliability, cost, yield, and productivity.
• Define process and equipment specifications using Design of Experiments (DOE) and data analysis.
• Develop equipment for evaluating silicon and package technologies under simulated field conditions.
• Establish material specifications for contract assemblers and raw material vendors.
• Lead continuous improvement initiatives using statistical methods to enhance equipment performance.

Requirements

• US Citizenship required.
• Bachelor's degree in Mechanical, Materials Science, Chemical, or Electrical Engineering (or STEM related) with 1+ years of experience, OR a Master's degree in the same fields.
• Associate degree in the same fields with 12+ years of experience.
• 6+ months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE).

Nice to have

• Prior experience working in a technology or semiconductor manufacturing environment.
• Experience in semiconductor packaging processes, including assembly, materials, or reliability engineering within a foundry context.

Culture & Benefits

• Competitive total compensation package including competitive pay and stock bonuses.
• Comprehensive benefit programs including health, retirement, and vacation.
• Opportunity to collaborate with world-class engineers on cutting-edge technology impacting the global tech industry.