Thin Films Module Development Engineer (Semiconductors)

Location: On-site in Hillsboro, Oregon, United States; support for 24/7 manufacturing operations with an on-call rotation.

Annual salary: $133,800–$188,890 USD.

Company

hirify.global develops semiconductor technologies and operates a foundry technology development organization.

What you will do

• Own thin-film metal deposition process development across ALD, CVD, PVD, sputtering, evaporation, electrochemical deposition, and related platforms.
• Design, implement, and optimize processes for materials performance, device performance, yield, and process control.
• Design, execute, and analyze experiments to meet integrated device requirements and accelerate yield improvement.
• Apply equipment, materials characterization, metrology, and device knowledge to accelerate technology development cycles.
• Evaluate novel materials and hardware, support equipment selection and qualification, and contribute to design for manufacturability.
• Partner with process integration, device engineering, metrology, yield, manufacturing, and equipment supplier teams on next-generation semiconductor technologies.

Requirements

• PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field.
• At least 1 year of experience with one or more thin-film deposition or vacuum process technologies.
• Experience analyzing process data using statistical methods, structured troubleshooting, and robust experimental design.
• Availability to work on site and support 24/7 manufacturing operations with an on-call rotation.
• Preferred experience with thin-film metal deposition for high-k/metal gate stacks, contact metallization, or copper interconnects.
• Preferred experience with materials characterization, semiconductor device fundamentals, data analysis tools, and AI-assisted engineering tools.

Culture & Benefits

• Cross-functional collaboration across technology development, integration, device engineering, metrology, yield, manufacturing, and equipment suppliers.
• Competitive compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• Fast-moving environment focused on solving challenging and ambiguous technical problems.