Process Integration, Yield and Defect Reduction Engineering Lead (Semiconductor Manufacturing)

Location: On-site in Albuquerque, New Mexico, United States

Annual salary: $140,830–$198,820 USD

Company

hirify.global develops and manufactures semiconductor technologies, including advanced packaging solutions.

What you will do

• Lead technical contributors supporting advanced packaging manufacturing operations.
• Support the transfer, ramp, and sustainment of advanced packaging technologies in high-volume manufacturing.
• Collaborate with engineering and factory operations teams to deliver against foundry customer commitments.
• Drive improvements in yield, quality, reliability, and manufacturing efficiency.
• Analyze defectivity and parametric data to identify yield limiters and implement process improvements.
• Develop inline monitoring systems, dashboards, and manufacturing health metrics.

Requirements

• Bachelor’s or master’s degree in chemical engineering, electrical engineering, mechanical engineering, materials science, microelectronics engineering, chemistry, physics, or a related technical field.
• 5+ years of experience in semiconductor manufacturing or advanced packaging.
• Experience in process integration or defect reduction for backend interconnect or advanced packaging processes.
• Experience applying Design of Experiments methodologies.
• Experience with data analysis and statistical process control using JMP, SQL, PCS, or similar tools.
• Strong project management, communication, stakeholder management, and cross-functional leadership skills.

Culture & Benefits

• On-site work model in a high-volume manufacturing environment.
• Competitive pay with stock bonuses.
• Health, retirement, and vacation benefits.
• Focus on responsible business practices and ethical hiring.