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14 часов назад

Process Integration Engineer (InP)

93 000 - 135 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Process Integration Engineer (InP): Owning end-to-end InP wafer fabrication flows for DFB lasers, SOAs, and gain chips with an accent on cross-module integration, yield analysis, and manufacturing robustness. Focus on analyzing process interactions, leading failure analysis and root-cause resolution, and supporting new product introduction in a semiconductor wafer fab.

Location: Alhambra, California, USA; onsite

Salary: $93,000–$135,000 per year

Company

hirify.global develops and manufactures semiconductor technologies, including photonic and optical communication products.

What you will do

  • Own and manage end-to-end InP wafer fabrication flows from epitaxy through backend processing.
  • Integrate lithography, etch, deposition, metallization, testing, and other wafer-fab modules while managing layer interactions, thermal budgets, process margins, and sequence dependencies.
  • Lead yield analysis, excursion response, defect reduction, and corrective-action activities.
  • Coordinate failure analysis using optical inspection, SEM, FIB, SIMS, electrical analysis, 8D, and Six Sigma methods.
  • Support new product introduction, process transfers, technology changes, and manufacturability assessments.
  • Maintain process flows, integration specifications, travelers, control plans, and PCM/TLM requirements while supporting manufacturing operations.

Requirements

  • Bachelor’s degree or higher in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field.
  • At least 5 years of experience in semiconductor process integration or device fabrication.
  • Hands-on experience with InP-based or III-V compound semiconductor wafer fabrication and multiple wafer-fab process modules.
  • Experience with yield analysis, defect reduction, root-cause methodologies, data analysis, and statistical process control.
  • Systems-level understanding of semiconductor device fabrication and process interactions, with the ability to drive cross-functional engineering decisions.
  • Experience with reliability testing, qualification flows, product lifecycle support, or high-mix, low-volume manufacturing is preferred.

Nice to have

  • Experience with DFB lasers, semiconductor optical amplifiers, gain chips, or photonic device manufacturing.
  • Familiarity with reliability testing, qualification flows, and product lifecycle support.
  • Experience supporting high-mix, low-volume manufacturing environments.

Culture & Benefits

  • Full-time employment in a manufacturing environment.
  • Cross-functional collaboration with process, device, reliability, design, and manufacturing teams.
  • Technical ownership of process integrity, yield improvement, and manufacturing support.

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