Advanced Packaging Process Integration Engineer

Location: Essex Junction, United States; advanced packaging activities are based in Burlington, Vermont. Travel up to 10%.

Salary: $143,000–$247,000 per year.

Company

hirify.global is a semiconductor foundry providing design, development, fabrication, and manufacturing services to technology companies across a global manufacturing footprint.

What you will do

• Lead advanced packaging process development, integration planning, and capability roadmaps in collaboration with unit process engineers, suppliers, internal teams, and OSATs.
• Develop semiconductor processes for CMP, wafer thinning, dicing, bumping, RDL, and assembly.
• Define assembly specifications and requirements for silicon photonics and other product lines.
• Drive next-generation packaging development from early prototyping through qualification and production readiness.
• Analyze failure modes and coordinate cross-functional resolution of technical issues.
• Develop process, materials, and tooling expertise while generating IP and supporting design-for-cost initiatives.

Requirements

• PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field.
• At least 15 years of related experience in wafer finishing and assembly processes.
• Experience with thinning, dicing, bumping, and RDL processes.
• English fluency required for written and verbal communication.
• Ability to travel up to 10%.

Nice to have

• Experience bringing packaged products from development into production.
• Project management, planning, organizational, and communication skills.
• Demonstrated leadership experience and the ability to execute solutions in ambiguous situations.

Culture & Benefits

• Work with internal design, fabrication, packaging, and process engineering groups.
• Collaborate directly with tools and materials suppliers and outsourced assembly and test providers.
• Support environmental, health, safety, and security programs.
• Employment is subject to applicable pre-employment conditions and laws.