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Senior Member of Technical Staff, Thin Films Engineer (Semiconductor Manufacturing)

155 520 - 298 440$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Senior Member of Technical Staff, Thin Films Engineer (Semiconductor Manufacturing): Developing and optimizing thin film deposition processes for advanced semiconductor technology nodes with an accent on yield, defectivity, uniformity, throughput, and manufacturability. Focus on solving complex manufacturing challenges across CVD, ALD, PVD, epitaxy, equipment optimization, and technology transfer into high-volume production.

Location: Hybrid work in Hillsboro, Oregon, or Phoenix, Arizona, United States, with on-site work at an assigned hirify.global site.

Annual salary: $155,520–$298,440 USD

Company

hirify.global develops semiconductor technologies and operates advanced manufacturing and foundry organizations serving internal and external customers.

What you will do

  • Lead development, optimization, and manufacturability of thin film deposition processes for advanced semiconductor technology nodes.
  • Improve safety, quality, yield, throughput, cost, defectivity, and process uniformity across deposition modules.
  • Resolve complex manufacturing problems spanning Technology Development, High-Volume Manufacturing, integration, device, yield, quality, reliability, and supplier teams.
  • Optimize equipment performance with internal engineering groups and equipment suppliers.
  • Translate customer requirements, technical data, and industry trends into manufacturing strategies and technology roadmaps.
  • Present technical findings to engineering teams, business groups, suppliers, and executive leadership.

Requirements

  • Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or a related STEM field.
  • 5+ years of semiconductor industry experience focused on thin film deposition processes.
  • Experience in process development, technical leadership, manufacturing engineering, and semiconductor fab operations.
  • Experience working with equipment suppliers such as AMAT, LAM, ASM, or TEL.
  • Experience with fab startups, Statistical Process Control, Design of Experiments, and factory automation systems.
  • Ability to work collaboratively in person at an assigned hirify.global manufacturing site.

Nice to have

  • Ph.D. with research publications and patents in thin film technologies.
  • Experience with Gate All Around logic technologies and semiconductor foundry environments.
  • Experience delivering solutions across Technology Development and High-Volume Manufacturing organizations.
  • Cross-functional leadership experience with diverse stakeholder groups.

Culture & Benefits

  • Hybrid work model combining on-site work at an assigned hirify.global site with off-site work.
  • Collaborative, in-person environment focused on rapid innovation and real-time problem resolution.
  • Health, retirement, and vacation benefits.
  • Competitive pay and stock bonuses.
  • Work on advanced semiconductor technologies and foundry manufacturing initiatives.

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