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3 часа назад

Process Development Engineer (InP Wafer Fab)

73 000 - 110 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Process Development Engineer (InP Wafer Fab) (PECVD, ICP-RIE/RIE): Developing, optimizing, and supporting manufacturing processes for InP-based photonic devices with an accent on dielectric deposition, plasma and wet etching, profile control, uniformity, and yield improvement. Focus on owning wafer-fab tools, solving process and equipment excursions through failure analysis and data-driven root-cause investigations, and scaling stable production processes.

Location: Alhambra, California, USA — onsite

Salary: $73,000–$110,000 per year

Company

hirify.global develops semiconductor and photonic device technologies, including InP-based products.

What you will do

  • Develop, qualify, optimize, and maintain PECVD dielectric deposition processes for InP-based device structures.
  • Develop and optimize ICP-RIE/RIE dry etch and wet etch processes for InP and related materials.
  • Own PECVD and ICP-RIE/RIE tools, including recipe control, chamber conditioning, process stability, preventive maintenance, and performance monitoring.
  • Improve film thickness, etch profiles, critical dimensions, uniformity, yield, and manufacturing stability.
  • Lead failure analysis, defect reduction, yield improvement, and root-cause investigations using data analysis, DOE, 8D, and Six Sigma methods.
  • Support NPI, process transfers, technology scaling, equipment qualifications, documentation, SPC control strategies, and manufacturing operations.

Requirements

  • Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field.
  • At least 3 years of semiconductor deposition and/or etch process engineering experience.
  • Hands-on experience with PECVD systems and ICP-RIE/RIE etch tools.
  • Strong understanding of InP or III-V compound semiconductor wafer fabrication, plasma processes, etch chemistries, and thin-film properties.
  • Experience with profile control, uniformity improvement, SPC, data analysis, and structured problem-solving.
  • Ability to take technical ownership in a manufacturing environment and provide hands-on or on-call support.

Nice to have

  • Experience with InP or III-V compound semiconductor devices.
  • Familiarity with DFB lasers, SOAs, gain chips, or photonic device manufacturing.
  • Experience in high-mix, low-volume manufacturing environments.
  • Experience with optical inspection, SEM, FIB, SIMS, and electrical analysis.

Culture & Benefits

  • Onsite work in Alhambra, California.
  • Hands-on support for wafer fabrication, manufacturing stability, and production scaling.
  • Cross-functional collaboration with photo, metallization, device, and manufacturing teams.
  • On-call manufacturing support as required.

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