Engineer II (DB & WB) (Semiconductor Assembly)

Location: Seremban, Malaysia

Company

hirify.global develops and manufactures semiconductor products, with this role supporting backend assembly operations.

What you will do

• Own and sustain Die Attach and Wire Bond processes and equipment, ensuring stable operation, high OEE, and compliance with process specifications.
• Manage tooling setup, calibration, alignment, qualification, and daily process and equipment support for production lines and lot transitions.
• Conduct DOE, FMEA, root cause analysis, and structured problem solving to resolve yield and quality issues including die tilt, voids, ball offset, wire lift, and non-stick.
• Optimize bonding parameters, validate Cpk, and lead NPI setup, conversion, buy-off, and material changes.
• Analyze UPH, yield, downtime, alarm, and equipment performance data using Spotfire, Power BI, Excel, or equivalent tools.
• Drive continuous improvement and cost reduction, implement digital controls and interlocks, document procedures, and train technicians and operators.

Requirements

• Bachelor’s degree in Mechanical, Electrical, Electronics, Mechatronics, or related engineering discipline.
• 2–3 years of hands-on experience supporting Die Bond and/or Wire Bond processes and equipment in semiconductor backend manufacturing.
• Strong understanding of Reel-to-Reel assembly lines and high-volume production environments.
• Hands-on experience with equipment setup, calibration, troubleshooting, and optimization.
• Knowledge of DOE, FMEA, SPC, 8D, and structured problem-solving methods.
• Ability to analyze manufacturing data using Excel, Spotfire, Power BI, or similar tools.
• Understanding of OEE, yield improvement, and process capability including Cpk.
• Experience supporting NPI, product conversion, and material qualification.
• Strong communication and cross-functional collaboration skills; self-motivated, detail-oriented, and able to work in a fast-paced manufacturing environment.

Culture & Benefits

• Full-time, hands-on work in a high-volume manufacturing environment.
• Close collaboration with QA, Production, Engineering, and Design teams.
• Inclusive and accessible recruitment process with fair consideration for applicants.
• Safe work environment and reasonable adjustments where requested.
• Employee resource groups, including the Pride Network Group and global and local Women’s groups.
• Commitment to increasing women in management positions to 30% by 2030.