Process and Equipment Engineer (Wafer Laser and Saw Singulation)

Location: Kulim, Malaysia. On-site presence is required; Shift 1 (Malaysia).

Company

hirify.global's Wafer Packaging Manufacturing organization develops wafer processing, laser manufacturing, and singulation solutions for next-generation computing platforms.

What you will do

• Own and optimize laser ablation and wafer saw parameters to improve yield, quality, throughput, and process robustness.
• Drive defect reduction for burrs, chipping, cracking, kerf quality, and recast.
• Troubleshoot laser ablation, laser dicing, and wafer saw equipment, and develop preventive and corrective maintenance strategies to improve uptime and Manufacturing Availability.
• Use SPC, DOE, FMEA, JMP, and advanced analytics to identify process and equipment root causes.
• Develop Python-, Copilot-, GitHub-, Gemini-, and AI-based solutions for defect monitoring, predictive maintenance, and process optimization.
• Collaborate with technology development teams, suppliers, factory stakeholders, and cross-functional process owners on technology qualification, NPI, equipment upgrades, documentation, and manufacturing improvements.

Requirements

• Bachelor's or Master's degree in Electrical, Electronics, Mechanical, Mechatronics, Materials Engineering, Physics, or a related engineering discipline.
• 0–1 year of relevant industry experience; fresh graduates with strong technical aptitude, problem-solving skills, and interest in semiconductor manufacturing are encouraged to apply.
• Ability to troubleshoot technical challenges using a structured, data-driven approach and work independently and in a team-based environment.
• Strong analytical, problem-solving, communication, and interpersonal skills.
• Willingness to work in a cleanroom manufacturing environment and support factory operations as required.

Nice to have

• More than 2 years of relevant industry experience.
• Experience in semiconductor manufacturing, wafer singulation, laser ablation, laser dicing, stealth dicing, wafer saw, die preparation, or advanced packaging.
• Knowledge of laser-material interaction, optics, motion control, vision alignment, and precision manufacturing technologies.
• Knowledge of SPC, statistical data analysis, DOE, FMEA, and root cause analysis.
• Experience with Python, JMP, SQL, Power BI, data analytics, automation, or AI-based manufacturing applications.
• Passion for continuous improvement, innovation, and cost reduction.

Culture & Benefits

• On-site work in a high-volume semiconductor manufacturing environment with cleanroom operations.
• Collaboration with global factory networks, technology development teams, equipment suppliers, and manufacturing stakeholders.
• Focus on safety, quality, yield, cost reduction, cycle-time optimization, and manufacturing scalability.
• Employment is subject to hirify.global safety, quality, environmental, and ethical hiring requirements; no recruitment or employment-related fees are charged.