Associate Engineer (Backgrind &Dicing)

Location: SGP - Science Park, Singapore; onsite work with 12-hour rotating shifts

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with manufacturing operations across three continents.

What you will do

• Support daily backgrind and dicing operations.
• Perform incoming and outgoing inspections, laminating, taping and detaping, backgrinding, and dicing according to process requirements.
• Measure wafer thickness and enter production data into SiView.
• Carry out planned equipment preventive maintenance.
• Record SPC data for defined critical equipment parameters.
• Work with process and equipment engineers, product and lot owners, and cross-functional teams to troubleshoot issues and improve processes.

Requirements

• Diploma or ITE Hi-Nitec qualification in Electrical, Electronic, or Mechanical Engineering.
• At least 2 years of experience in an electronic production environment, preferably OSAT or assembly.
• Hands-on experience with backgrind or dicing processes.
• Ability to work 12-hour rotating shifts.
• MS Office literacy and knowledge of statistical process control (SPC).
• Ability to follow environmental, health, safety, and security requirements.

Culture & Benefits

• Inclusive and multicultural workplace.
• Equal opportunity employment.
• Employment offers are subject to background checks, applicable medical screenings, and local legal requirements.