Advanced Packaging Substrate Supplier Enablement Lead (Semiconductor Manufacturing)

Location: On-site in Phoenix, Arizona, United States. The role includes periodic evening meetings with suppliers in East Asia and occasional travel to supplier sites.

Annual salary range: $164,100–$231,670 USD.

Company

hirify.global develops semiconductor technologies and advanced packaging and manufacturing solutions.

What you will do

• Lead substrate supplier development and qualification for high-density FCBGA, EMIB-T, and glass core substrate technologies.
• Define process integration roadmaps and manufacturing procedures for technology transfer milestones.
• Manage supplier readiness milestones and coordinate technical enablement with engineering teams and external partners.
• Analyze structured and unstructured data using statistical analysis and coding techniques to improve yield.
• Lead low-yield investigations, corrective actions, and continuous improvement initiatives in high-volume production.
• Assess quality and reliability risks associated with manufacturing material and process changes.

Requirements

• Bachelor’s degree in engineering, physics, materials science, or a related field with 9+ years of relevant experience; or a master’s degree with 6+ years; or a PhD with 4+ years.
• Experience with process integration methodologies and tools used in semiconductor manufacturing.
• Experience in advanced packaging, substrates, or semiconductor process development.
• Expertise in structured problem solving, data-driven decision-making, supplier management, and technology enablement.
• Strong collaboration, influencing, and communication skills across global cross-functional teams.
• Ability to work on-site in Phoenix and attend periodic evening meetings with East Asian suppliers.

Culture & Benefits

• Opportunities to contribute to advanced packaging technology development and hirify.global’s technical leadership.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Mentoring and collaboration across global, cross-functional teams.