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13 часов назад

MTS Packaging Integration Engineer (Photonics)

94 300 - 175 100$
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
MTS Packaging Integration Engineer (Photonics): Developing and integrating advanced packaging for electro-optical transceivers using silicon photonics, 2.5D and 3D co-packaged optics, with an accent on photonic and electrical interconnect compatibility, materials selection, and reliability qualification. Focus on defining assembly process specifications, resolving process integration and yield issues, developing manufacturing-driven design rules, and bringing packaged products from development into production.

Location: USA — Vermont — Essex Junction

Salary: $94,300–$175,100 per year, depending on qualifications, experience, and location.

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with a global manufacturing footprint.

What you will do

  • Define process integration specifications for assembly flows of silicon photonics co-packaged optics modules, targeting cost, yield, and reliability goals.
  • Develop manufacturing-driven packaging design rules and support customer design enablement.
  • Lead packaging design reviews, materials selection, failure mode and effects analyses, and product risk assessments.
  • Resolve process integration, quality, technical, and yield issues through complex analysis and data-driven investigations.
  • Develop custom processes, module characterization methods, test structures, and continuous improvement plans.
  • Drive product qualification, packaging innovation, and transition of packaged products from development into production with internal and OSAT teams.

Requirements

  • MS or PhD with 4 or more years of experience.
  • Extensive experience in failure analysis, design of experiments, and packaging process integration.
  • Experience bringing packaged products from development into production.
  • Strong written and spoken English communication skills required.
  • Ability to support environmental, health, safety, and security requirements.

Nice to have

  • Background in materials science, thermal or mechanical engineering, and simulation.
  • Experience with photonic and electrical interconnect innovation and product release through an OSAT ecosystem.
  • Deep knowledge of 2D, 2.5D, 3D, and 3.5D silicon photonics advanced packaging and chip-package interaction.
  • Knowledge of global technology and commercial trends in technology, design, and manufacturing.

Culture & Benefits

  • Work within a global semiconductor manufacturing organization.
  • Collaborate with cross-functional teams and OSAT partners.
  • Contribute to standardized global qualification and site-based quality processes.
  • Equal opportunity employment and reasonable accommodation support are provided in accordance with applicable laws.

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