13 часов назад
MTS Packaging Integration Engineer (Photonics)
94 300 - 175 100$
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
MTS Packaging Integration Engineer (Photonics): Developing and integrating advanced packaging for electro-optical transceivers using silicon photonics, 2.5D and 3D co-packaged optics, with an accent on photonic and electrical interconnect compatibility, materials selection, and reliability qualification. Focus on defining assembly process specifications, resolving process integration and yield issues, developing manufacturing-driven design rules, and bringing packaged products from development into production.
Location: USA — Vermont — Essex Junction
Salary: $94,300–$175,100 per year, depending on qualifications, experience, and location.
Company
is a full-service semiconductor foundry providing design, development, and fabrication services with a global manufacturing footprint.
What you will do
- Define process integration specifications for assembly flows of silicon photonics co-packaged optics modules, targeting cost, yield, and reliability goals.
- Develop manufacturing-driven packaging design rules and support customer design enablement.
- Lead packaging design reviews, materials selection, failure mode and effects analyses, and product risk assessments.
- Resolve process integration, quality, technical, and yield issues through complex analysis and data-driven investigations.
- Develop custom processes, module characterization methods, test structures, and continuous improvement plans.
- Drive product qualification, packaging innovation, and transition of packaged products from development into production with internal and OSAT teams.
Requirements
- MS or PhD with 4 or more years of experience.
- Extensive experience in failure analysis, design of experiments, and packaging process integration.
- Experience bringing packaged products from development into production.
- Strong written and spoken English communication skills required.
- Ability to support environmental, health, safety, and security requirements.
Nice to have
- Background in materials science, thermal or mechanical engineering, and simulation.
- Experience with photonic and electrical interconnect innovation and product release through an OSAT ecosystem.
- Deep knowledge of 2D, 2.5D, 3D, and 3.5D silicon photonics advanced packaging and chip-package interaction.
- Knowledge of global technology and commercial trends in technology, design, and manufacturing.
Culture & Benefits
- Work within a global semiconductor manufacturing organization.
- Collaborate with cross-functional teams and OSAT partners.
- Contribute to standardized global qualification and site-based quality processes.
- Equal opportunity employment and reasonable accommodation support are provided in accordance with applicable laws.
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