MTS Packaging Integration Engineer (Photonics)

Location: Essex Junction, Vermont, United States

Salary: $94,300–$175,100 per year; exact salary depends on qualifications, experience, and location.

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with manufacturing operations across three continents.

What you will do

• Define process integration specifications for co-packaged optics assembly flows targeting cost, yield, and reliability goals.
• Develop manufacturing-driven design rules and support customer design enablement, product innovation, and efficient internal and OSAT manufacturing processes.
• Drive packaging design reviews, materials selection, FMEAs, quality analysis, and evaluation of financial implications of quality issues.
• Identify and resolve process integration, technical, and yield issues; develop custom or derivative processes for customer requirements.
• Support new designs through module characterization, test-structure development, and rigorous process qualification.
• Lead project management, data analysis, continuous improvement plans, global qualification activities, and environmental, health, safety, and security compliance.

Requirements

• MS or PhD degree plus 4 or more years of experience.
• Extensive experience with failure analysis, design of experiments, and packaging process integration.
• Experience bringing packaged products from development into production.
• Strong written and spoken English communication skills.

Nice to have

• Background in materials science, thermal engineering, mechanical engineering, or simulation.
• Validated experience innovating and releasing photonic and electrical interconnect products internally or through an OSAT ecosystem.
• Expertise in chip-package interaction for 2D, 2.5D, 3D, and 3.5D silicon photonics advanced packaging.
• Broad and deep knowledge of global technology and commercial trends in current and future technology, design, and manufacturing.

Culture & Benefits

• Full-time employment in an onsite semiconductor manufacturing environment.
• Work includes collaboration with cross-functional teams and OSAT partners.
• Activities must follow Environmental, Health, Safety & Security requirements and programs.
• Employment is subject to applicable pre-employment conditions and laws.