12 часов назад
Photonic Packaging Engineer, Principal (Silicon Photonics)
205 000 - 260 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Photonic Packaging Engineer, Principal (Silicon Photonics): Leading the design, development, and productization of advanced photonic packaging solutions for silicon photonics modules and next-generation data center networking platforms with an accent on optical coupling, EIC/PIC co-packaging, thermal management, and precision optomechanical integration. Focus on defining scalable package architectures, guiding multidisciplinary product realization from R&D through high-volume manufacturing, and improving reliability, yield, and supplier technologies.
Location: San Jose, California, United States
Salary: $205,000–$260,000 per year, depending on experience, level, and business need. The role may also be eligible for a discretionary bonus, incentives, and benefits.
Company
provides rack-scale AI infrastructure through semiconductor-based connectivity solutions and software for data center and networking platforms.
What you will do
- Lead end-to-end photonic packaging strategies for silicon photonics modules, including EIC/PIC co-packaging, optical coupling, fiber attach, and thermal and mechanical design.
- Define package architectures and technical requirements that balance optical and electrical performance, manufacturability, cost, and compatibility with electronic packaging flows.
- Collaborate with IC packaging, optical connector, silicon photonics, electrical packaging, systems, and supply chain teams on co-design optimization.
- Build and mentor a multidisciplinary team of packaging engineers and scientists.
- Lead supplier engagement, technology partnerships, failure analysis, reliability testing, and yield improvement.
- Develop the long-term package technology roadmap for advanced optical integration and scalability.
Requirements
- Ph.D. or M.S. in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field.
- 10+ years of experience in photonic packaging, optical transceivers, or advanced semiconductor packaging.
- Expertise in high-speed optical and electrical packaging, thermal management, precision optomechanical design, and optoelectronic package integration.
- Track record of leading complex hardware from R&D through high-volume manufacturing.
- Strong program management, cross-functional leadership, communication, negotiation, and organizational skills.
Nice to have
- Experience with silicon photonics integrated devices.
- Familiarity with advanced packaging optics trends and data center network architectures.
- Background in contract manufacturing, vendor qualification, and global supply chain management.
Culture & Benefits
- Discretionary bonus, incentives, and benefits may be available.
- Inclusive environment encouraging applications from people with diverse backgrounds and experiences.
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