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12 часов назад

Photonic Packaging Engineer, Principal (Silicon Photonics)

205 000 - 260 000$
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Photonic Packaging Engineer, Principal (Silicon Photonics): Leading the design, development, and productization of advanced photonic packaging solutions for silicon photonics modules and next-generation data center networking platforms with an accent on optical coupling, EIC/PIC co-packaging, thermal management, and precision optomechanical integration. Focus on defining scalable package architectures, guiding multidisciplinary product realization from R&D through high-volume manufacturing, and improving reliability, yield, and supplier technologies.

Location: San Jose, California, United States

Salary: $205,000–$260,000 per year, depending on experience, level, and business need. The role may also be eligible for a discretionary bonus, incentives, and benefits.

Company

hirify.global provides rack-scale AI infrastructure through semiconductor-based connectivity solutions and software for data center and networking platforms.

What you will do

  • Lead end-to-end photonic packaging strategies for silicon photonics modules, including EIC/PIC co-packaging, optical coupling, fiber attach, and thermal and mechanical design.
  • Define package architectures and technical requirements that balance optical and electrical performance, manufacturability, cost, and compatibility with electronic packaging flows.
  • Collaborate with IC packaging, optical connector, silicon photonics, electrical packaging, systems, and supply chain teams on co-design optimization.
  • Build and mentor a multidisciplinary team of packaging engineers and scientists.
  • Lead supplier engagement, technology partnerships, failure analysis, reliability testing, and yield improvement.
  • Develop the long-term package technology roadmap for advanced optical integration and scalability.

Requirements

  • Ph.D. or M.S. in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field.
  • 10+ years of experience in photonic packaging, optical transceivers, or advanced semiconductor packaging.
  • Expertise in high-speed optical and electrical packaging, thermal management, precision optomechanical design, and optoelectronic package integration.
  • Track record of leading complex hardware from R&D through high-volume manufacturing.
  • Strong program management, cross-functional leadership, communication, negotiation, and organizational skills.

Nice to have

  • Experience with silicon photonics integrated devices.
  • Familiarity with advanced packaging optics trends and data center network architectures.
  • Background in contract manufacturing, vendor qualification, and global supply chain management.

Culture & Benefits

  • Discretionary bonus, incentives, and benefits may be available.
  • Inclusive environment encouraging applications from people with diverse backgrounds and experiences.

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