Module Process Engineer V (Semiconductor Packaging)

Location: Albany, NY, United States

Salary: $140,000–$192,500 per year

Company

hirify.global develops materials engineering solutions, equipment, and services for semiconductor and advanced display manufacturing.

What you will do

• Develop advanced packaging modules using the equipment portfolio and advise the Packaging Business Unit on equipment requirements.
• Drive materials and process development for logic, DRAM, and NAND through structured problem solving and experimentation.
• Provide expertise in wafer-to-wafer and die-to-wafer bonding, micro-bumps, TSVs, thermal and stress management, optics, and multi-wafer stacking.
• Design and tape out test vehicles, define engineering plans and DOEs, lead characterization, and prepare technical reports.
• Improve packaging interconnect performance by reducing RC delay and increasing wiring density across polymer and thin-film dielectrics.
• Serve as an IMS module expert, lead cross-functional initiatives, develop packaging roadmaps, and support product portfolio strategy and intellectual property filings.

Requirements

• Bachelor’s or master’s degree in electrical, mechanical, materials engineering, or a related field; PhD preferred.
• 10+ years of semiconductor packaging development and manufacturing experience.
• Strong communication and collaboration skills across business units, manufacturing organizations, and customers.
• Experience leading global, cross-functional projects in a fast-paced environment.
• Ability to work independently, resolve complex technical challenges, and influence business results.

Culture & Benefits

• Supportive environment focused on learning, professional development, and career growth.
• Comprehensive employee benefits and programs supporting health and wellbeing.
• Full-time regular employment with 10% travel expected.
• Relocation assistance is available.
• Additional compensation may include bonuses and stock awards, as applicable.