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11 часов назад

Lead Package Assembly Integrator (Photonics)

218 000 - 317 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Lead Package Assembly Integrator (Photonics): Developing end-to-end 3D package assembly, testing, and fiber-attach processes for photonics products used in AI data centers and high-end computing, with an accent on manufacturability, performance, and reliability. Focus on defining test-chip strategies, validating assembly design rules, executing design-of-experiments, and solving thermal, mechanical, and material reliability challenges.

Location: Mountain View, California, United States; flexible hybrid workplace model

Salary: $218,000–$317,000 USD per year base salary, plus equity and other rewards.

Company

hirify.global develops photonics-based AI data center infrastructure, including 3D-stacked photonics engines for extreme-scale computing.

What you will do

  • Develop end-to-end 3D package assembly, testing, and fiber-attach processes with foundry and OSAT partners.
  • Develop package architectures and designs optimized for performance, manufacturability, yield, and long-term reliability.
  • Define test-chip requirements, manage test-chip design, and develop assembly test vehicles.
  • Validate assembly design rules covering packaging, RDL, substrates, thermal and mechanical solutions, fiber attach, and system integration.
  • Plan design-of-experiments, manage data, and analyze assembly process and design interactions.
  • Identify reliability risks, drive mechanical-integrity improvements, and communicate results to internal stakeholders, suppliers, and customers.

Requirements

  • MS or PhD in Mechanical Engineering, Materials Science, or a related engineering field.
  • Experience developing wafer-scale packaging assembly processes.
  • Knowledge of 2D and 3D packaging technologies, materials, and equipment requirements.
  • Experience defining test-chip and assembly-test vehicle requirements.
  • Understanding of photonics packaging requirements and fiber-attach methods.
  • Experience with advanced packaging technologies, including thermal, mechanical, and reliability considerations.

Nice to have

  • Experience with thermal and mechanical modeling and coding for data analysis.
  • Strong project ownership and experience solving complex technical challenges independently.
  • Ability to communicate complex technical concepts to technical and non-technical stakeholders.

Culture & Benefits

  • Comprehensive medical, dental, and vision coverage.
  • Retirement savings matching, life insurance, and short- and long-term disability coverage.
  • Vacation, sick leave, public holidays, and paid family leave.
  • Training and development, commuter benefits, and equity grants for full-time employees.
  • Ability to comply with federally mandated U.S. export control requirements.

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