Packaging Module Development Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States

Annual salary: $133,800–$219,550 USD

Company

hirify.global develops and commercializes semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.

What you will do

• Develop First-, Second-, and Mid-Level Interconnect solutions and thermal interface technologies for future packaging platforms.
• Optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Innovate materials, equipment, and fabrication processes for semiconductor packaging at scale.
• Manage technical projects and deliver product development milestones.
• Support equipment performance and process health in high-volume manufacturing.
• Respond to foundry customer requests and events while collaborating with cross-functional teams.

Requirements

• Regular on-site presence in Phoenix, Arizona is required.
• PhD with one or more years of experience in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, Applied Physics, or a related field.
• Minimum GPA of 3.5 and at least three publications in peer-reviewed technical journals.
• Strong technical leadership, critical thinking, communication, influencing, and analytical skills.
• Ability to work independently, manage changing priorities, and lead or coach technical teams in a matrixed organization.

Nice to have

• Experience with technology development, Statistical Process Control, or Design of Experiments.
• Experience delivering complex, time-critical technical projects.
• Semiconductor fabrication process or semiconductor foundry experience.

Culture & Benefits

• Full-time employment with competitive pay and stock bonuses.
• Health, retirement, and vacation benefits.
• Work is performed on-site during Shift 1 in the United States.