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12 часов назад

Packaging Module Development Engineer

133 800 - 219 550$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

Текст:
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TL;DR

Packaging Module Development Engineer (Semiconductor Packaging): Developing First, Second, and Mid-Level Interconnect (FLI, SLI, MLI) and thermal interface solutions for hirify.global's future packaging platforms with an accent on innovative materials, equipment, and fabrication processes. Focus on optimizing assembly processes for quality, reliability, cost, yield, productivity, and manufacturability while managing projects to meet timelines.

Location: US, Arizona, Phoenix - requires regular onsite presence

Salary: $133,800–219,550

Company

hirify.global Foundry delivers cutting-edge silicon process and packaging technology for AI-era products, with global manufacturing scale and focus on customer service.

What you will do

  • Develop FLI, SLI, MLI, and thermal interface solutions for advanced packaging platforms.
  • Collaborate with cross-functional teams to optimize assembly processes for quality, reliability, yield, and manufacturability.
  • Innovate materials, equipment, and fabrication processes to enhance semiconductor packaging at scale.
  • Manage projects to meet product development timelines and provide sustaining support for high-volume manufacturing.
  • Respond to foundry customer requests and solve technical problems using formal education and judgment.

Requirements

  • PhD with 1+ years in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related field
  • Minimum GPA of 3.5
  • At least three publications in peer-reviewed technical journals
  • Technical leadership, strategic planning, critical thinking, and strong communication skills
  • Ability to coach teams, work independently, and adapt in a dynamic, matrixed environment
  • Regular onsite presence required in Phoenix, Arizona, US

Nice to have

  • Experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
  • Delivering results for complex, time-critical technical projects
  • Semiconductor fabrication processes and technology
  • Previous work in a semiconductor foundry

Culture & Benefits

  • Competitive pay, stock bonuses, health, retirement, and vacation benefits
  • Work in a worldwide factory network focused on state-of-the-art semiconductor manufacturing
  • Shift 1 (United States of America)

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