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6 часов назад

Chief Packaging Engineer (Quantum Computing)

208 000 - 260 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Chief Packaging Engineer (Quantum Computing): Defining and executing advanced packaging architecture for next-generation ion traps and related components with an accent on mechanical, thermal, electrical, and photonic interfaces. Focus on leading high-density I/O and heterogeneous packaging development, validating manufacturing processes with vendors, and building scalable packaging roadmaps for quantum computing hardware.

Location: Hybrid at the assigned location in Brooklyn Park, Minnesota, or Broomfield, Colorado; remote work may be approved for up to 2 days per week.

Salary: $208,000–$260,000 annually, inclusive of bonus target.

Company

Quantum computing company developing integrated full-stack quantum systems by combining quantum hardware and software.

What you will do

  • Define and drive advanced packaging architecture for next-generation ion traps with complex optical, electrical, and mechanical interfaces.
  • Lead cross-functional teams developing packaging strategies for large-format ion trap chips with high-density I/O.
  • Define and oversee short development loops to evaluate mechanical, thermal, electrical, and optical performance requirements.
  • Work with external vendors to implement and validate packaging processes.
  • Support ion trap development and ensure compatibility with packaging and system requirements.
  • Provide technical guidance to packaging engineers and develop supplier partnerships and co-development opportunities.

Requirements

  • Bachelor’s degree and 18+ years of advanced semiconductor packaging development experience, or a Master’s degree and 15+ years, or a PhD and 12+ years.
  • Must be a U.S. Person: U.S. citizen, permanent resident or green card holder, or worker granted asylum or refugee status.
  • Due to U.S. Government national security requirements, candidates must not be nationals of China or Russia unless they are also U.S. citizens.
  • Broad and deep knowledge of microelectronic and photonic packaging for mechanical, thermal, electrical, and optical interfaces.
  • Experience leading cross-functional technical work and partnering with external vendors.

Nice to have

  • PhD in Physics or Engineering.
  • Experience with large-area multi-chip semiconductor packaging, photonic packaging, and fiber-to-chip or chip-to-chip optical coupling.
  • Experience with heterogeneous integration, 2.5D–3D packaging, high-density I/O, innovation, and IP development.

Culture & Benefits

  • Flexible work schedule with hybrid workplace flexibility.
  • Employer-subsidized health, dental, and vision insurance.
  • Equity, 401(k) retirement savings plan, and student loan repayment benefit.
  • Paid holidays, vacation, sick time, and parental leave.
  • Employee discounts and incentive eligibility.

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