Quantum Assembly Engineer (Quantum Packaging)

Location: Essex Junction, United States

Salary: $118,000–$210,000 per year

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services across a global manufacturing footprint.

What you will do

• Develop cryogenic-compatible assembly processes for 2D, 2.5D, and 3D quantum packaging platforms.
• Define flip-chip, micro-bump, superconducting bump attach, die-to-wafer, wafer-to-wafer, and hybrid bonding schemes.
• Own assembly integration flows from incoming wafers and dies through package build, including bump, interposer, TSV, substrate, and package integration.
• Enable prototype builds, assembly readiness, tooling and materials selection, and process scale-up with internal and external partners.
• Improve yield and throughput while reducing alignment defects, voiding, delamination, and interconnect failures.
• Support hardware bring-up, validation, failure analysis, and debugging in cryogenic environments such as dilution refrigerators.

Requirements

• Master’s degree in electrical, mechanical, or chemical engineering, materials science, or a related field.
• At least 10 years of related work experience with a master’s degree.
• In-depth knowledge of BEOL processes, bump and wafer-finish integration, wafer test and probe, OSAT collaboration, package development, and assembly.
• Strong problem-solving, technical troubleshooting, and design-of-experiments skills.
• Fluent written and verbal English required.
• Ability to travel up to 10%.

Nice to have

• PhD-level education with at least 8 years of related work experience.
• Prior leadership experience and project management skills.
• Strong written and verbal communication, planning, and organizational skills.

Culture & Benefits

• Collaborate with quantum device, packaging, cryogenic systems, hardware, equipment, OSAT, supplier, and assembly partner teams.
• Contribute to the quantum packaging roadmap, capability build-out, intellectual property, publications, and conference presentations.
• Participate in hiring, mentoring, and guiding new Advanced Packaging team members.
• Work in a multicultural and inclusive environment with equal-opportunity employment practices.

Hiring process

• Employment is conditional on successful completion of applicable pre-employment background checks and medical screenings.
• Reasonable accommodation is available during the employment process upon request.