Quantum Packaging Thermal Architect (Quantum Computing)

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $141,910–$200,340 USD

Company

Intel Corporation's Quantum Computing Group develops silicon-based quantum processors using spin qubits in silicon quantum dots and advanced semiconductor manufacturing capabilities.

What you will do

• Model and simulate thermal behavior in packaging hardware, from silicon test chips through heat spreaders.
• Integrate packaging hardware and coordinate co-design across relevant stakeholders.
• Collaborate with mechanical designers to define heat spreaders for optimal performance.
• Deliver design milestones and communicate technical designs through presentations and documentation.
• Track developments in packaging technology and design techniques through conferences and technical papers.

Requirements

• M.S. degree in Electrical Engineering, Physics, or a related field with 5+ years of thermal modeling and simulation experience, or a Ph.D. with relevant academic or work experience.
• Experience with thermal and mechanical modeling, simulation, and optimization using tools such as Ansys Icepak and COMSOL.
• Understanding of packaging technologies and thermal integration.
• Strong analytical, problem-solving, communication, and presentation skills.
• Ability to collaborate across diverse teams in a fast-paced research environment.
• Ability to work on-site in Hillsboro, Oregon, United States.

Nice to have

• 2+ years of experience with thermal and mechanical cryogenic packaging modeling and simulation.

Culture & Benefits

• Work in a multidisciplinary quantum computing research environment.
• Collaborate with research divisions and academic institutions.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.