Quantum Packaging Signal/Power Integrity (SI/PI) Engineer (Quantum Computing)

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $141,910–$200,340 USD

Company

Quantum Computing Group developing silicon-based quantum processors using spin qubit technology in silicon quantum dots and semiconductor manufacturing expertise.

What you will do

• Model and simulate packaging hardware, including redistribution layers, interposers, IC substrates, and silicon testchip routing.
• Perform system-level and end-to-end simulations to verify designs against requirements.
• Collaborate with theory and hardware stakeholders to define requirements and develop novel packaging hardware.
• Deliver design milestones and communicate results through technical presentations and documentation.
• Track advances in packaging technology and design techniques through conferences and technical papers.

Requirements

• M.S. degree in Electrical Engineering, Physics, or a related field with 3+ years of relevant experience, or a Ph.D. in a related field with academic or work experience.
• Experience with SI/PI modeling, simulation, and optimization using tools such as SIwave, HFSS, ADS, or related software.
• Experience evaluating SI, PI, and thermal impacts on IC substrate design choices.
• Design experience with large-form-factor IC substrates.
• Strong analytical, problem-solving, communication, presentation, and collaboration skills.

Nice to have

• 1+ years of experience with testchip SI software for large-scale automation, such as RaptorH/X.

Culture & Benefits

• Multidisciplinary research environment focused on advancing quantum computing technology.
• Competitive compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• On-site work model in the United States.