Advanced Packaging Top Die Module Engineer

Location: On-site in Albuquerque, New Mexico, United States

Annual salary: $103,730–$198,820 USD

Company

hirify.global develops and manufactures semiconductor technologies and integrated circuits.

What you will do

• Operate and optimize high-volume semiconductor manufacturing equipment and processes.
• Conduct tests and measurements to evaluate equipment and process performance, improving productivity, quality, and yield.
• Execute equipment and module maintenance, repairs, upgrades, installation, conversion, and qualification.
• Lead continuous improvement initiatives focused on safety, productivity, cost efficiency, and yield.
• Develop excursion prevention systems and address discrepant materials or activities.
• Support global technology transfer through training, audits, documentation, and process standardization.

Requirements

• Bachelor’s degree in a STEM field or related discipline.
• 4+ years of relevant experience with a bachelor’s degree, 3+ years with a master’s degree, or no experience with a PhD.
• Proficiency in semiconductor metrology, process characterization, and manufacturing process improvement.
• Experience developing and maintaining process controls, identifying excursions, and implementing process changes.
• Strong knowledge of Design of Experiments (DOE) and semiconductor manufacturing equipment and processes.
• Availability for on-site work in Albuquerque, New Mexico, United States.

Nice to have

• Hands-on experience in semiconductor process analytical metrology or process development.
• Knowledge of statistical methodologies, tool matching, tool qualification, and experimental design.
• Understanding of logic or memory semiconductor process flows and metrology assessments.
• Project management experience leading task forces through complex technical challenges.
• Experience collaborating across diverse global teams.

Culture & Benefits

• Competitive pay with stock bonuses.
• Health, retirement, and vacation benefits.
• Work within an engineering organization focused on semiconductor manufacturing innovation and global technology advancement.