Quantum Bump Integration Engineer (Quantum Packaging)

Location: Essex Junction, United States

Salary: $98,000–$176,000 per year

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services across a global manufacturing footprint.

What you will do

• Develop cryogenic-compatible bump interconnect technologies using indium, SnAg, Cu pillar, and superconducting metals.
• Define and optimize bump structures, metallurgy, process flows, and integration schemes for superconducting packaging.
• Own wafer-level bump integration through assembly, qualification, and transition from R&D to pilot or high-volume manufacturing.
• Establish process windows for electrical, thermal, and mechanical stability at millikelvin-to-kelvin temperatures.
• Improve yield, defectivity, reliability, and manufacturability through DOE, statistical analysis, and root-cause investigations.
• Collaborate with qubit, cryogenic systems, packaging, assembly, modeling, reliability, test, design, vendor, and OSAT teams.

Requirements

• Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field.
• At least 8 years of related professional experience with a master’s degree.
• In-depth knowledge of BEOL processes, bump and wafer-finish integration, wafer test and probe, OSAT collaboration, package development, and assembly.
• Strong problem-solving, technical troubleshooting, and design-of-experiments skills.
• Overall GPA of at least 3.0 and good academic standing.
• Written and verbal English fluency required; travel of up to 10%.

Nice to have

• PhD education level with at least 5 years of related experience.
• Prior leadership, project management, planning, organizational, and communication experience.

Culture & Benefits

• Work with advanced packaging and photonics technologies for scalable quantum hardware.
• Collaborate with multidisciplinary internal teams, external partners, tool suppliers, vendors, and OSAT providers.
• Contribute to invention disclosures, publications, conference presentations, process specifications, and integration guidelines.
• Equal opportunity workplace with a focus on diversity, inclusion, and respectful collaboration.
• Employment is subject to applicable background checks, medical screenings, and local laws.