Lead Fab Technology Engineer, Surface Preparation and Integration (Semiconductors)

Location: Minato-ku, Tokyo, Japan; travel within Japan and to global locations as needed, up to 30%.

Company

hirify.global develops material solutions for semiconductor manufacturing and supports customer process adoption and commercialization.

What you will do

• Act as the technical expert for Selective Wet Etch and Clean processes in Surface Preparation and Integration across Asia.
• Lead customer evaluations, qualifications, product presentations, and technical discussions with account managers.
• Develop strategies to grow revenue and market share for SPI material solutions.
• Identify and prioritize customer opportunities using the value selling process.
• Collaborate with equipment OEMs, R&D, business units, supply chain, quality, and account management teams.
• Manage customer process and product knowledge, support product positioning and lifecycle management, and contribute to technical roadmaps.

Requirements

• Bachelor’s degree in chemistry, chemical engineering, materials science, or engineering with 10+ years of Wet Etch and Clean experience in semiconductor processing, fab environments, or equipment/material suppliers.
• Alternatively, a master’s degree or PhD in a relevant field with 8+ years of Wet Etch and Clean experience.
• Extensive experience in Wet Etch and Clean process development in an advanced wafer fab environment, including advanced logic or memory vertical/3D architectures, or at a semiconductor equipment company.
• Strong analytical problem-solving, communication, teamwork, and technical presentation skills.
• English-speaking and presentation skills are required; TOEIC >600 is preferred.
• The position is specific to Tokyo or nearby areas in Japan.

Nice to have

• Experience with surface analytical techniques.
• Sales or management experience.

Culture & Benefits

• Self-directed work with minimal supervision.
• Collaboration with regional and global SPI leadership and functional teams.
• Regular customer engagement and participation in regional and global opportunity reviews.
• International travel and exposure to semiconductor customers, equipment OEMs, and product development teams.