7 дней назад
Dry Etch Process Engineer III
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Dry Etch Process Engineer III (Semiconductor Manufacturing): Developing new and modified dry etch process formulations and defining equipment requirements for manufacturing and product evaluation with an accent on process physics, handling methods, and fabrication techniques. Focus on exploiting process mechanisms on production equipment, specifying processing requirements, and supporting domestic and international travel.
Location: Boise, Idaho, United States. Domestic and international travel is required 25% of the time. Applicants must have the legal right to work in the United States.
Company
America, Inc. provides semiconductor manufacturing equipment and process technologies.
What you will do
- Develop new or modified dry etch process formulations.
- Define processing and handling equipment requirements and specifications.
- Review processing techniques and methods used in product manufacture, fabrication, and evaluation.
- Analyze the physics and mechanisms of processes running on equipment.
- Apply process knowledge to achieve manufacturing and process goals.
- Travel domestically and internationally approximately 25% of the time.
Requirements
- Experience with dry etch process engineering and semiconductor manufacturing processes.
- Understanding of process physics and mechanisms operating on manufacturing equipment.
- Ability to define equipment requirements and processing specifications.
- Legal right to work in the United States is required if employment is offered.
Culture & Benefits
- Full-time employment based in Boise, Idaho.
- Opportunity to work on manufacturing, fabrication, and product evaluation processes.
- Domestic and international travel is part of the role.
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