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11 часов назад

Process Engineer II (Microelectronics Packaging)

84 000 - 126 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Process Engineer II (Microelectronics Packaging): Developing and transferring stable, cost-effective, and scalable microelectronic packaging assembly processes into high-volume manufacturing with an accent on process validation, equipment qualification, statistical process control, and quality-system compliance. Focus on designing experiments, resolving process yield and equipment issues, and establishing robust production controls for printed circuit board assembly and wafer-level packaging and test.

Location: Tempe, Arizona, United States; onsite 4 days per week.

Salary: $84,000–$126,000 per year, plus eligibility for the hirify.global Incentive Plan.

Company

hirify.global develops healthcare technologies designed to alleviate pain, restore health, and extend life, serving patients across more than 150 countries.

What you will do

  • Develop and transfer stable, cost-effective, and scalable microelectronic packaging assembly processes into manufacturing.
  • Support printed circuit board assembly, wafer-level packaging, and test process development.
  • Scout materials, equipment, tooling, fixtures, and manufacturing process options; assess inputs, outputs, and alignment with requirements.
  • Perform equipment qualifications, process validations, process characterization, OQ/PQ activities, and gage R&R studies.
  • Monitor process output, conduct experiments, apply statistical methods, and resolve process yield issues through root-cause analysis.
  • Provide sustaining engineering support, troubleshoot equipment and production issues, and maintain documentation in compliance with quality regulations.

Requirements

  • Bachelor’s degree with 2+ years of relevant experience, or a master’s degree with 0+ years of relevant experience.
  • Unrestricted U.S. work authorization is required at hire and throughout employment; sponsorship is not available for this role.
  • For bachelor’s degrees earned outside the United States, the degree must satisfy the requirements of 8 C.F.R. § 214.2(h)(4)(iii)(A).
  • Ability to work onsite four days per week and collaborate with manufacturing and cross-functional teams.
  • Ability to work hands-on with manufacturing equipment and processes, including troubleshooting and process monitoring.

Nice to have

  • Experience with microelectronics packaging processes such as pick and place, solder printing, underfill, reflow, cleaning, singulation, automated inspection, and metrology.
  • Experience developing processes from concept through manufacturing transfer or working in a high-volume facility.
  • Knowledge of DOE, statistical analysis, Minitab, JMP, SPC, process capability analysis, and control charts.
  • DRM/DFSS, Lean Sigma, or Green/Black Belt Lean Sigma experience or certification.
  • Experience programming, operating, and troubleshooting automated equipment, machine vision, and automated metrology tools.

Culture & Benefits

  • Mission-driven work focused on healthcare technology and patient outcomes.
  • Health, dental, and vision insurance, with HSA and healthcare FSA options for eligible regular employees.
  • 401(k) plan with employer contribution and match, paid time off, paid holidays, and short-term disability coverage.
  • Tuition assistance or reimbursement, life insurance, long-term disability leave, and employee assistance resources.
  • Employee Stock Purchase Plan and incentive plans for eligible employees.

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