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3 часа назад

Quality Process Engineer - Semiconductor Manufacturing

75 000 - 115 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Quality Process Engineer - Semiconductor Manufacturing (Chip-Scale Packaging): Driving corrective action closure and technical problem-solving across semiconductor backend assembly operations with an accent on flip chip, wafer-level CSP, die attach, molding, and plating processes. Focus on root cause investigations, DOE, SPC, process validation, and eliminating recurring manufacturing quality issues.

Location: Colorado Springs, USA — onsite

Salary: $75,000–$115,000 USD annually

Company

hirify.global develops semiconductor products for circuit protection, RF applications, power management, wireless charging, sensing, and connected infrastructure.

What you will do

  • Own and drive closure of more than 70 corrective action reports across engineering, operations, maintenance, and systems engineering.
  • Lead cross-functional reviews and apply 8D, 5-Why, fishbone, fault tree analysis, and Design of Experiments to identify root causes.
  • Support qualification and validation of flip chip, wafer-level CSP, die attach, molding, and plating processes.
  • Investigate solder joint integrity, die cracking, underfill defects, warpage, yield, and process variability issues.
  • Apply SPC, process capability analysis, MSA, and Gage R&R to validate processes and corrective actions.
  • Support NPI, IQ/OQ/PQ, FAI, pFMEA, Control Plans, audits, supplier corrective actions, and quality documentation.

Requirements

  • Bachelor’s degree in Engineering, Materials Science, Physics, or a related technical field.
  • 5+ years of quality engineering experience in semiconductor backend assembly or microelectronics packaging.
  • Hands-on experience with chip-scale packaging, including flip chip, wafer-level CSP, or advanced packaging processes.
  • Expertise in structured problem-solving, root cause analysis, SPC, Cpk/Ppk, hypothesis testing, and DOE.
  • Working knowledge of AIAG Core Tools, including PFMEA, Control Plans, MSA, PPAP, and APQP, plus ISO 9001 or equivalent quality systems.
  • Proficiency with Minitab, JMP, or equivalent statistical analysis software and strong cross-functional communication skills.

Nice to have

  • Master’s degree, Six Sigma Green or Black Belt, CQE or CQA certification, or ISO 9001/IATF 16949 Lead Auditor certification.
  • Experience with wafer fabrication, flip chip bumping, RDL, advanced wafer-level packaging, OSATs, or foundries.
  • Knowledge of automotive, aerospace, or medical device quality standards and semiconductor reliability testing.
  • Familiarity with SEM, X-ray, C-SAM, profilometry, MES systems, and advanced DOE methods.

Culture & Benefits

  • Work within a quality team supporting ISO 9001 certification and the transition to IATF 16949.
  • Collaborate with process engineering, operations, maintenance, systems engineering, suppliers, and site leadership.
  • Support two manufacturing sites and more than 1,000 controlled documents.
  • Contribute to semiconductor products used in industrial, medical, communications, consumer, and connected infrastructure applications.

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