Packaging Integration Engineer (Semiconductor Packaging)

Location: Essex Junction, United States

Expected salary: $85,000–$146,000 per year

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with manufacturing operations across three continents.

What you will do

• Support assembly process integration for silicon photonics and advanced packaging products.
• Assist with process development, characterization, and qualification for new package technologies.
• Analyze engineering and manufacturing data to identify process improvement opportunities.
• Participate in failure analysis, root cause investigations, and package reliability testing.
• Collaborate with design, product, manufacturing, quality, and supplier teams to resolve technical challenges.
• Develop design rules, assess manufacturability, document experimental results, and support continuous improvement in yield, quality, cost, and reliability.

Requirements

• Graduating with a bachelor's, master's, or PhD degree in materials science engineering, mechanical engineering, electrical engineering, chemical engineering, physics, or a related STEM discipline.
• Overall GPA of at least 3.0 and good academic standing.
• Basic understanding of semiconductor packaging, silicon photonics, materials science, reliability, or manufacturing processes through coursework, research, internships, co-ops, or academic projects.
• Analytical, problem-solving, experimental data analysis, and cross-functional collaboration skills.
• English fluency required for written and verbal communication.
• Availability for travel of up to 10% to other hirify.global facilities.

Nice to have

• Experience with semiconductor packaging, silicon photonics, reliability engineering, failure analysis, materials characterization, thermal or mechanical simulation, or process integration.
• Familiarity with Design of Experiments methodologies and statistical data analysis tools.
• Knowledge of flip-chip, chiplet, 2.5D, or 3D integration technologies.
• Leadership, project management, planning, organizational, and technical communication skills.

Culture & Benefits

• Full-time employment for new college graduates.
• Accelerated training in a fast-paced work environment.
• Mentorship, networking, and leadership development opportunities.
• Cross-functional collaboration and opportunities for talent mobility.
• Hands-on experience with advanced semiconductor packaging technologies alongside experienced engineers.