2 часа назад
Backend Process Engineer (InP Wafer Fab)
100 000 - 135 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Backend Process Engineer (InP Wafer Fab) (Semiconductor Manufacturing): Developing, optimizing, and supporting backend wafer fabrication processes for InP-based photonic devices with an accent on wafer thinning, n-side metallization, rapid thermal annealing, and automated optical inspection. Focus on improving yield, reducing defects, establishing process controls, and supporting singulation, optical coatings, reliability readiness, and packaging interfaces.
Location: Alhambra, California, USA; onsite
Salary: $100,000–$135,000 per year
Company
develops semiconductor technologies and photonic solutions.
What you will do
- Own and optimize backend wafer fabrication processes for InP-based photonic devices, including wafer lapping and thinning, n-side metallization, and rapid thermal annealing.
- Establish process windows, recipes, control limits, SPC metrics, and control strategies for backend modules.
- Manage automated optical inspection, analyze inline and post-process data, and drive yield improvement and defect reduction.
- Support cleaving, dicing, singulation, AR/HR optical coatings, vendor qualifications, and packaging readiness.
- Support new product introduction, process transfers, technology changes, and backend risk evaluation.
- Author SOPs, travelers, process specifications, and control plans while providing manufacturing troubleshooting support.
Requirements
- Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field.
- At least 3 years of experience in backend semiconductor processing.
- Hands-on experience with lapping/thinning, metallization, and thermal processes.
- Understanding of InP-based or III-V compound semiconductor wafer fabrication processes.
- Experience with AOI systems, yield analysis, SPC, DOE, and statistical process improvement.
- Understanding of singulation, packaging interfaces, and reliability requirements, with the ability to collaborate across manufacturing and engineering teams.
Nice to have
- Experience with InP or III-V optoelectronic devices.
- Familiarity with AR/HR optical coating processes.
- Experience in high-mix, low-volume manufacturing environments.
Culture & Benefits
- Full-time onsite manufacturing and engineering role.
- Hands-on collaboration across packaging, device, reliability, manufacturing, and engineering teams.
- Work focused on manufacturing stability, yield, defect reduction, and continuous process improvement.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →
Похожие вакансии
18 часов назад
Staff Process Integration Engineer (III-V Semiconductor)
108 800 - 155 400$
5 дней назад
Process Engineer – Die to Wafer Hybrid Bonding
147 000 - 202 500$
20 часов назад
Process Engineer - Ion Implant (Semiconductor Manufacturing)
67 812 - 101 719$
18 часов назад
Senior Engineer I-Process (Semiconductor Manufacturing)
70 304 - 205 000$
20 часов назад
Senior Process Engineer (Semiconductor Manufacturing)
117 768 - 176 652$
4 дня назад
System Engineer - Wet Equipment (Semiconductor)
138 000 - 190 000$