Senior PCB Designer (Space Infrastructure)

Location: Site-based hybrid role requiring work at least 3 days (60%+) per week from a hirify.global office or work location in the United States. Locations include Tempe, Arizona, and Carlsbad, California.

Salary: $99,500–$157,000 annually; $123,500–$185,500 annually for specific locations in San Jose, the San Francisco Bay Area, and the New York City metropolitan area.

Company

hirify.global develops communication technologies and infrastructure serving consumers, businesses, governments, and military customers worldwide.

What you will do

• Design complex multilayer PCB layouts using Mentor Graphics Xpedition and CES.
• Own component placement, routing, stack-up definition, constraint management, and layout release for digital, analog, RF, and power circuits.
• Develop 10+ layer boards with controlled impedance, differential pairs, length matching, signal integrity, and power integrity considerations.
• Collaborate with electrical, mechanical, RF, thermal, manufacturing, and test engineers throughout design reviews and development.
• Perform SI/PI analysis, EMI/EMC risk mitigation, layout trade studies, prototype bring-up, debugging, and iteration.
• Release fabrication and assembly packages, improve DFM/DFA/DFT practices, and help establish PCB standards and workflows while mentoring junior designers.

Requirements

• Associate's degree in electrical engineering or equivalent professional experience.
• 5–8 years of professional PCB layout experience, including ownership of complex multilayer designs.
• 5+ years of direct experience with Mentor Xpedition and CES, plus schematic capture experience.
• Experience with high-speed digital, mixed-signal, and power electronics layouts, including signal integrity, power integrity, EMI/EMC, and manufacturability.
• Experience producing fabrication and assembly packages and working with board houses and assemblers.
• US Citizenship required. Ability to travel up to 10%.

Nice to have

• Flex and rigid-flex circuit experience, high-speed materials, RF transmission lines, controlled impedance, and fine-pitch BGAs.
• Experience with JTAG, RGMI, DSP, DDR, LVDS, SERDES, Ethernet, and RF layout development.
• Familiarity with hierarchical schematics, layout reuse, SI/PI simulation tools, constraint-driven design, automation, or scripting.
• Experience supporting rapid development cycles, prototype iteration, production ramp-up, or high-reliability aerospace, space, or automotive hardware.

Culture & Benefits

• Work with cross-functional engineering teams on space infrastructure and ground systems.
• Contribute to design standards, workflow improvements, and organization-wide PCB quality and efficiency.
• Medical, financial, wellness, and other benefits may be provided depending on the position.
• Additional cash or stock incentives may be available.