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1 день назад

Sr Principal PCB Design Engineer (Semiconductor)

136 200 - 178 815$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Sr Principal PCB Design Engineer (Semiconductor): Leading the architecture, layout, and release of advanced multilayer probe card PCBs for HBM, high-speed digital, RF, and mixed-signal semiconductor test applications with an accent on signal integrity, power distribution, manufacturability, and advanced packaging. Focus on defining stackups and routing strategies, solving complex design and manufacturing issues, mentoring PCB designers, and improving design automation and engineering standards.

Location: Livermore, California, United States; regular day shift and full-time onsite work.

Salary: $136,200.00–$178,815.00 per year.

Company

hirify.global provides semiconductor test and measurement technologies supporting device characterization, reliability, design debugging, qualification, and production testing.

What you will do

  • Lead architecture, layout, and implementation of complex multilayer probe card PCBs for semiconductor test applications.
  • Develop high-density, high-speed, high-current designs for HBM, RF, mixed-signal, and advanced packaging applications.
  • Drive designs from concept through release while meeting schedule, quality, reliability, and manufacturability objectives.
  • Define stackups, routing strategies, impedance requirements, power distribution networks, constraints, and design rules.
  • Collaborate with signal integrity, electrical, mechanical, applications, manufacturing, supply chain, and external supplier teams.
  • Provide technical leadership, mentor PCB designers, support root-cause analysis, and improve design tools, automation, standards, and workflows.

Requirements

  • Bachelor’s degree in Electrical Engineering, Electronics Engineering, or a related technical field, with at least 8 years of related experience; equivalent combinations of advanced education and experience are accepted.
  • Expertise with PCB layout tools such as Cadence Allegro or Siemens Xpedition.
  • Experience designing complex multilayer boards with HDI, BGAs, microvias, and advanced packaging technologies.
  • Strong knowledge of high-speed signal routing, signal integrity, power integrity, controlled impedance, DFM, DFA, PCB fabrication, and assembly.
  • Ability to independently lead technically challenging projects, communicate effectively, solve complex problems, and mentor designers.
  • Experience with semiconductor test hardware, probe cards, global engineering organizations, automation, scripting, or PCB process optimization.

Culture & Benefits

  • Collaboration across global engineering, manufacturing, applications, and supplier organizations.
  • Medical, dental, vision, life insurance, disability coverage, and paid time off.
  • 401(k) with company match, employee stock purchase plan, and flexible spending or savings accounts.
  • Quarterly profit-sharing bonuses.
  • Day-shift schedule and an environment focused on customer ownership, accountability, communication, and professional development.

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