Principal PCB Designer (Aerospace)

Location: Site-based role in Tempe, Arizona or Carlsbad, California; employees work at least 3 days (60%+) per week from a hirify.global office or work location. US citizenship required.

Salary: $135,000–$213,500 annually. For specific locations in San Jose, the San Francisco Bay Area, and the New York City metropolitan area, the range is $168,000–$252,000 annually.

Company

hirify.global develops connectivity solutions for consumers, businesses, governments, and military organizations worldwide.

What you will do

• Lead PCB design across multiple space infrastructure programs and product lines.
• Produce complex multilayer, high-speed, mixed-signal, RF, and power-dense layouts using Mentor Graphics Xpedition and CES.
• Define component placement, routing architecture, constraint sets, and layer stackups from architecture through fabrication and assembly release.
• Provide technical leadership on signal integrity, power integrity, EMI/EMC mitigation, manufacturability, yield, and design tradeoffs.
• Lead design reviews, resolve complex layout issues, and collaborate with electrical, RF, mechanical, manufacturing, thermal, and test engineers.
• Schedule and prioritize work for direct reports, mentor PCB designers, and improve standards, workflows, quality, and execution speed.

Requirements

• 10+ years of professional PCB layout experience with ownership of highly complex designs.
• 5+ years of direct experience with Mentor Xpedition and CES.
• Expert knowledge of signal integrity, power integrity, EMI/EMC, high-speed digital, RF, and power electronics layout.
• Experience with schematic capture, technical reviews, fabrication and assembly release packages, and cross-functional engineering collaboration.
• Management experience leading a technical team and the ability to act independently as a technical authority.
• US citizenship is required; ability to travel up to 10%.

Nice to have

• Experience in space, aerospace, defense, automotive, or other high-reliability hardware environments.
• Experience with flex and rigid-flex circuits, high-speed materials, controlled impedance, RF transmission lines, BGAs, and differential routing.
• Knowledge of JTAG, RGMI, DSP, DDR, LVDS, SERDES, Ethernet, hierarchical schematics, layout reuse, automation, scripting, or CAD customization.

Culture & Benefits

• Work in an inclusive environment focused on positive impact and complex global connectivity challenges.
• Medical, financial, and other benefits are provided based on the position offered.
• Additional cash or stock incentives may be available.