Lead Engineer, Solutions Engineering (CMP)

Location: Zhudong, Hsinchu County, Taiwan; onsite role

Company

hirify.global develops materials, products, and solutions for semiconductor manufacturing.

What you will do

• Interpret customer requirements and critical-to-quality factors to define semiconductor CMP problems.
• Propose CMP products and processes, including slurry, pads, conditioning disks, and post-CMP cleaning solutions.
• Lead product design-space assessments and cleanroom experiments with sales, customer technology, R&D, and manufacturing teams.
• Plan, execute, summarize, and statistically analyze experiments using JMP and other analysis tools.
• Communicate conclusions, prepare solution data packages, and promote solutions internally and with customers.
• Develop practical engineering methods to accelerate customer product adoption and build expertise in hirify.global technologies.

Requirements

• In-depth understanding of semiconductor CMP processes and the impact of CMP consumables on performance.
• Working experience in CMP-related manufacturing or semiconductor fabrication is required.
• Bachelor’s degree in chemistry, materials science, chemical engineering, or a related technical field.
• Experience leading complex engineering projects and working effectively in multifunctional teams.
• Knowledge of Six Sigma and design of experiments, with strong statistical data analysis skills using JMP or Minitab.
• Strong written and oral communication, systematic problem-solving, adaptability, and commitment to continuous learning.

Nice to have

• Advanced technical degree.
• Knowledge of semiconductor devices and integration schemes.

Culture & Benefits

• Hands-on, results-oriented work with minimal direction.
• Close collaboration across sales, customer engineering, R&D, and manufacturing functions.
• Opportunities to work with leading-edge semiconductor technologies and products.