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6 дней назад

Customer Technical Service Engineer (Wafer Level Packaging)

Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
Taiwan
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Customer Technical Service Engineer (Wafer Level Packaging) (Semiconductor/WLP): Providing on-site technical and operational support for wafer-level packaging customers in Taiwan, including trials, laboratory experiments, logistics, troubleshooting, and data analysis with an accent on customer-site execution, semiconductor materials, and process support. Focus on investigating chemical and process issues, coordinating root-cause analysis, managing wafer and sample logistics, and driving technical issues through resolution.

Location: Customer sites in Taiwan; frequent travel within Taiwan is required

Company

hirify.global develops electronic materials and technical solutions for wafer-level packaging, circuitry, semiconductor assembly, and related electronics applications.

What you will do

  • Provide on-site technical and operational support to wafer-level packaging and semiconductor customers.
  • Support product evaluations, qualifications, process trials, demonstrations, and customer follow-up.
  • Investigate chemical and process-related issues, collect data and samples, and coordinate root-cause analysis and corrective actions.
  • Coordinate wafer, sample, chemical, and material logistics, ensuring proper handling, delivery, and traceability.
  • Perform basic laboratory testing, sample preparation, and data analysis, coordinating advanced analytical work when needed.
  • Prepare technical reports, communicate customer requirements internally, and collaborate with Sales, R&D, Product Management, Quality, Manufacturing, Supply Chain, and Customer Service.

Requirements

  • At least 2 years of experience in semiconductors, wafer-level packaging, plating, semiconductor materials, or related technical service roles.
  • Experience in customer technical service, field engineering, process engineering, application engineering, or semiconductor equipment and material support.
  • Basic understanding of wafer-level packaging, wafer processing, electroplating, semiconductor chemicals, or advanced packaging processes.
  • Experience handling wafers, materials, samples, customer trial logistics, laboratory experiments, and technical troubleshooting.
  • Good command of English and Mandarin Chinese is required for communication with customers and global internal teams.
  • Ability to manage multiple customer requests and projects, communicate technical issues clearly, and work directly at customer sites.

Nice to have

  • Experience supporting Tier-1 semiconductor manufacturers such as TSMC, ASE, SPIL, or Micron.
  • Bachelor’s degree or higher in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering, or a related discipline.
  • Proficiency in Microsoft Office, particularly Excel and PowerPoint.

Culture & Benefits

  • Customer-facing work in a fast-paced semiconductor environment.
  • Cross-functional collaboration with technical, commercial, manufacturing, quality, and supply chain teams.
  • Work involving wafers, chemicals, laboratory equipment, and customer process materials under appropriate safety and handling procedures.
  • Strong emphasis on customer focus, ownership, accountability, collaboration, and problem-solving.

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