Packaging Research and Development Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States; the role is based at hirify.global's Chandler, Arizona campus and requires regular factory-floor presence. Occasional supplier and partner travel of less than 5% is expected.

Annual salary: $133,800–$188,890 USD

Company

hirify.global is a semiconductor company developing computing technologies, including advanced semiconductor packaging and manufacturing capabilities.

What you will do

• Define equipment configurations, process specifications, and integrated process flows for emerging substrate packaging technologies.
• Plan and conduct Design of Experiments to characterize process windows and interactions between processes, equipment, and materials.
• Improve process capability, stability, quality, reliability, cost, yield, automation, and productivity.
• Lead and participate in cross-functional teams supporting substrate technology development.
• Collaborate with equipment and materials suppliers to evaluate, qualify, and optimize technologies and solutions.
• Apply analytical and characterization techniques and use statistical analysis and programming to interpret complex datasets.

Requirements

• PhD in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a closely related field.
• At least 1 year of relevant science or engineering experience through academic research, internships, or professional work.
• Experience with engineering troubleshooting, analytical problem-solving, and cross-functional technology challenges.
• Experience owning and operating process tools, with knowledge of SPC, PCS, RFC processes, equipment troubleshooting, Design of Experiments, and process development.
• Clear written and verbal communication, ownership, adaptability, and a solutions-oriented approach.

Nice to have

• Experience with organic and inorganic materials and characterization methods including DSC, TGA, D/TMA, Titration, ICP-MS, FTIR, XPS, TOF-SIMS, EDX, and SEM.
• Experience with JMP, JSL, Python, relational databases, and machine learning concepts.

Culture & Benefits

• Hands-on work with advanced equipment and materials in a semiconductor packaging research and manufacturing facility.
• Collaboration with engineers, suppliers, and cross-functional partners.
• Competitive pay, stock bonuses, health benefits, retirement programs, and vacation.
• Full-time employment with Shift 1 scheduling.