Mechanical Engineer II (Aerospace)

Company

hirify.global develops space and defense technologies for launching, landing, and operating space systems from Earth to the Moon and beyond.

What you will do

• Design ruggedized electronics packaging and structural components for PCB assemblies used in launch vehicles and spacecraft.
• Develop electro-mechanical assemblies for thermal, dynamic, EMI/EMC, and radiation environments.
• Perform steady-state thermal, thermal cycling, modal, and vibration analyses.
• Design test fixtures and ground support hardware for launch vehicle and spacecraft electronics.
• Support vibration, shock, and thermal testing campaigns, including hands-on build and integration.
• Create CAD models, part and assembly drawings, technical documentation, presentations, and reports while collaborating with PCB and cross-functional engineering teams.

Requirements

• Bachelor’s degree in mechanical engineering, aerospace engineering, or a related field.
• At least 3 years of experience designing electronics packaging and electro-mechanical assemblies through internships, professional experience, or academia.
• At least 3 years of 3D CAD design and drafting experience.
• Experience or knowledge in mechanical packaging calculations, tolerance stack-ups, bolt loads, venting, EMI/EMC mitigation, and PCB solder-joint fatigue.
• Knowledge of launch vehicle avionics integration, instrumentation interfaces, GD&T, and environmental testing.
• Experience designing parts for CNC machining and sheet-metal production, including material and finishing-process selection.

Nice to have

• Hands-on electronics packaging design and integration experience.
• Proficiency with NX or similar CAD software and analysis tools such as ANSYS.
• Experience with multi-layer PCBA enclosure design.

Culture & Benefits

• Collaborative work with avionics and engineering teams across the company.
• Work on launch vehicle and spacecraft hardware for critical space missions.