Packaging Design Integration Engineer (2026 New College Graduate) (Silicon Photonics)

Location: Essex Junction, United States. Travel to other hirify.global facilities may be required, up to 10%.

Salary: $85,000–$146,000 per year, depending on qualifications, experience, and location.

Company

hirify.global is a semiconductor foundry providing design, development, and fabrication services with manufacturing operations across three continents.

What you will do

• Support packaging design integration for silicon photonics and advanced packaging products.
• Assist with thermal, mechanical, electrical, and optical chip package co-design analysis for electro-optical transceivers.
• Contribute to design rule development, manufacturability assessments, design reviews, and technical documentation.
• Use simulations, engineering data, and characterization results to evaluate design options and identify improvements.
• Participate in cross-functional problem-solving related to technical performance, yield, quality, and reliability.
• Collaborate with design, product, process integration, manufacturing, quality, and supplier teams on new customer products.

Requirements

• Graduating with a Bachelor’s, Master’s, or PhD degree in mechanical engineering, electrical engineering, materials science engineering, chemical engineering, physics, optical engineering, or a related STEM discipline.
• Overall GPA of at least 3.0 and good academic standing.
• Basic understanding of semiconductor packaging, silicon photonics, chip package co-design, modeling and simulation, materials science, reliability, or manufacturing processes.
• Analytical, problem-solving, data analysis, and cross-functional collaboration skills.
• Written and verbal English fluency required.

Nice to have

• Internship, co-op, research, or academic project experience in advanced packaging, silicon photonics, design integration, reliability engineering, or process integration.
• Familiarity with HFSS, Zemax, FloTHERM, finite element analysis, electrical simulation, optical simulation, or related engineering tools.
• Knowledge of flip-chip, chiplet, 2.5D, or 3D integration technologies.
• Experience with Design of Experiments, engineering statistics, or data analysis methods.
• Leadership, project management, communication, planning, and organizational skills.

Culture & Benefits

• Full-time employment path for recent graduates.
• Accelerated training in a fast-paced engineering environment.
• Mentorship, networking, and leadership opportunities.
• Cross-functional collaboration and opportunities for talent mobility.
• Work focused on design quality, manufacturability, cost, reliability, and safety.