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2 часа назад

Principal Advanced Packaging Design Engineer (AI)

168 400 - 249 310$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Principal Advanced Packaging Design Engineer (AI): Leading the design and simulation of complex high-performance computing and AI packaging solutions with an accent on 2.5D/3D configurations and advanced substrates. Focus on managing cross-functional project teams, ensuring signal and power integrity, and collaborating with suppliers to deliver innovative, manufacturable hardware.

Location: Burlington, VT (Onsite)

Salary: $168,400–$249,310 per annum

Company

hirify.global is a global leader in semiconductor solutions, providing the essential infrastructure for data, cloud, and AI architectures.

What you will do

  • Lead small project teams of design and simulation engineers to deliver high-quality packaging solutions.
  • Develop complex package architectures for HPC, AI, and networking applications.
  • Interface with package suppliers to ensure manufacturability, reliability, and cost-effectiveness.
  • Collaborate with chip design and electrical simulation teams to optimize design performance.
  • Manage programs involving cross-functional stakeholders across multiple time zones.
  • Contribute to tool, process, and flow development, including library maintenance.

Requirements

  • Must be eligible to access export-controlled information under U.S. law.
  • Bachelor’s degree in electrical engineering with 15+ years of experience, or Master’s with 12+ years, or PhD with 8+ years.
  • Extensive experience in substrate and board design for advanced package technologies.
  • Mastery of Cadence 3DIC/ISP/APD/SiP tools and workflows.
  • Strong understanding of 2.5D/3D package technologies like CoWoS, EMIB, CPO, and CPC.
  • Proven ability to lead complex architecture development projects.

Nice to have

  • Experience with signal and power integrity simulations using Sigrity, Clarity, or Ansys.
  • Familiarity with AutoCAD and SolidWorks.
  • Experience with high-speed interfaces like HBM, DDR, SerDes, and PCIe.

Culture & Benefits

  • Comprehensive financial well-being programs including an employee stock purchase plan.
  • Robust mental health resources and family support programs.
  • Recognition and service awards for employee contributions.
  • Commitment to professional growth and long-term career development.

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