Principal Advanced Packaging Design Engineer

Location: Burlington, VT, United States

Salary: $168,400–$249,310 per year

Company

hirify.global develops semiconductor solutions for enterprise, cloud and AI, carrier, networking, and high-performance computing infrastructure.

What you will do

• Lead small project teams of design and simulation engineers delivering advanced packaging solutions.
• Develop package architectures for high-performance computing, AI, and networking products.
• Evaluate package technologies and work with suppliers to ensure manufacturability, reliability, performance, and cost compliance.
• Design and optimize substrates, boards, breakout structures, placement and routing, signal shielding, reference planes, power distribution, and pinouts.
• Collaborate with chip design, electrical simulation, internal stakeholders, external customers, and cross-functional teams.
• Contribute to tool, process, flow, and library development and interpret signal and power integrity simulations.

Requirements

• Bachelor’s degree in electrical engineering or a related field with 15+ years of related experience, master’s degree with 12+ years, or PhD with 8+ years.
• Extensive experience in substrate and/or board design for advanced package technologies.
• Proven ability to lead complex package architecture development projects involving internal and external stakeholders.
• Mastery of Cadence 3DIC, ISP, APD, and SiP tools and workflows.
• Experience with HBM, DDR, SerDes, D2D, D2H, ADC, DAC, PCIe, Ethernet, and related high-speed interfaces.
• Ability to work with stakeholders across multiple time zones and communicate technical decisions clearly.

Nice to have

• Experience with Cadence Sigrity, Clarity, Innovus, Virtuoso, Ansys, AutoCAD, and SolidWorks.
• Familiarity with signal and power integrity simulations.
• Experience with advanced 2.5D/3D packaging technologies such as CoWoS, EMIB, CPO, and CPC.

Culture & Benefits

• Employee stock purchase plan with a two-year lookback.
• Family support programs for work-life balance.
• Mental and physical health resources.
• Recognition and service awards.
• Employment benefits supporting employees from onboarding through retirement.

Hiring process

• Interviews evaluate individual experience, thought process, and communication skills.
• AI tools, transcription apps, answer generators, and automated note-taking bots are not permitted during interviews.
• Access to export-controlled technology may require an export license review before employment.