Advanced Packaging Engineer, Principal (Photonics)

Location: San Jose, California, United States; on-site

Salary: $185,000–$240,000 per year, depending on experience, level, and business need. The role may also include a discretionary bonus, incentives, and benefits.

Company

hirify.global provides rack-scale AI infrastructure through semiconductor-based connectivity solutions and software for hyperscalers and ecosystem partners.

What you will do

• Lead advanced packaging R&D for optical chips and next-generation NPO and CPO products.
• Define and optimize wafer-level, panel-level, and die-level packaging process flows, including 2.1D, 2.5D, and 3D integration.
• Drive EIC-to-PIC integration and optical device integration efforts.
• Select and qualify advanced packaging materials while partnering with OSATs, tool vendors, and material suppliers.
• Characterize and improve package yield, reliability, and process capability.
• Develop and maintain packaging PDKs and design rules.

Requirements

• B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
• 8+ years of semiconductor or advanced packaging engineering experience with demonstrated technical leadership.
• Deep expertise in 2.5D/3D integration, flip-chip, hybrid bonding, Cu pillar, TSV, RDL, and overmold processes.
• Experience with silicon photonics chip packaging, EIC/PIC integration, and advanced packaging materials.
• Experience qualifying equipment and processes with OSATs or tool suppliers.
• Experience with PDK development, packaging design rules, yield analysis, reliability characterization, Cpk, and SPC.

Nice to have

• Hands-on CPO or NPO product development experience.
• Experience with optical coupling or waveguide alignment for photonic integration.
• Familiarity with photonics chip design, photonics devices, DFM, and DFT.

Culture & Benefits

• Discretionary bonus and incentive eligibility may be available.
• Benefits are included as part of the compensation package.
• Inclusive environment welcoming diverse backgrounds and experiences.