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11 часов назад

Mechanical Design Engineer (Photonics)

135 000 - 212 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Mechanical Design Engineer (Photonics) (AI data center packaging): Designing advanced semiconductor packages and optically aligned assemblies for AI and HPC systems with an accent on mechanical integrity, micron-level tolerances, and thermal performance. Focus on CAD modeling, GD&T and tolerance stack-up analysis, prototype validation, and developing scalable manufacturing solutions for 3D, 2.5D, and FCBGA architectures.

Location: Mountain View, California, United States; flexible hybrid workplace model

Salary: $135,000–$212,000 USD per year, plus equity grants and other rewards.

Company

hirify.global develops photonics-based computing and data center infrastructure for advanced AI and high-performance computing workloads.

What you will do

  • Create CAD models for package stack-ups and associated components.
  • Perform mechanical design analysis and identify solutions that improve package integrity.
  • Execute tolerance stack-up analyses and create GD&T drawings for advanced packages and optically aligned assemblies.
  • Apply manufacturing expertise to design decisions, perform FMEAs, and assess process and design costs.
  • Manage prototype builds with external vendors and validate designs for high-volume manufacturability.
  • Collaborate with packaging and systems teams to meet system-level mechanical, optical, thermal, assembly, and reliability requirements.

Requirements

  • BS or MS in Mechanical Engineering or a related field.
  • At least 3 years of mechanical design experience in semiconductor packaging, optoelectronics, or photonics modules.
  • Proficiency with CAD tools such as SolidWorks or Creo and mechanical design best practices.
  • Expertise in GD&T and tolerance stack-up analysis.
  • Working knowledge of semiconductor packaging technologies, including 3D, 2.5D, and FCBGA architectures and their mechanical and thermal trade-offs.
  • Capacity to comply with federally mandated U.S. export control requirements.

Nice to have

  • Knowledge of ASME Y14.5 standards.
  • Experience with FEA tools such as ANSYS or Abaqus for structural and thermal analysis.
  • Fiber array unit attach, optical connector, or photonic alignment experience.
  • Experience with liquid cooling or advanced thermal architectures for AI/HPC systems.
  • Exposure to high-volume manufacturing and OSAT engagement in Asia.

Culture & Benefits

  • Flexible hybrid workplace model.
  • Medical, dental, and vision coverage.
  • Retirement savings matching, life insurance, disability coverage, and paid family leave.
  • Vacation, sick leave, public holidays, commuter benefits, and training and development.
  • Equity grants for full-time employees.

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