11 часов назад
Mechanical Design Engineer (Photonics)
135 000 - 212 000$
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Mechanical Design Engineer (Photonics) (AI data center packaging): Designing advanced semiconductor packages and optically aligned assemblies for AI and HPC systems with an accent on mechanical integrity, micron-level tolerances, and thermal performance. Focus on CAD modeling, GD&T and tolerance stack-up analysis, prototype validation, and developing scalable manufacturing solutions for 3D, 2.5D, and FCBGA architectures.
Location: Mountain View, California, United States; flexible hybrid workplace model
Salary: $135,000–$212,000 USD per year, plus equity grants and other rewards.
Company
develops photonics-based computing and data center infrastructure for advanced AI and high-performance computing workloads.
What you will do
- Create CAD models for package stack-ups and associated components.
- Perform mechanical design analysis and identify solutions that improve package integrity.
- Execute tolerance stack-up analyses and create GD&T drawings for advanced packages and optically aligned assemblies.
- Apply manufacturing expertise to design decisions, perform FMEAs, and assess process and design costs.
- Manage prototype builds with external vendors and validate designs for high-volume manufacturability.
- Collaborate with packaging and systems teams to meet system-level mechanical, optical, thermal, assembly, and reliability requirements.
Requirements
- BS or MS in Mechanical Engineering or a related field.
- At least 3 years of mechanical design experience in semiconductor packaging, optoelectronics, or photonics modules.
- Proficiency with CAD tools such as SolidWorks or Creo and mechanical design best practices.
- Expertise in GD&T and tolerance stack-up analysis.
- Working knowledge of semiconductor packaging technologies, including 3D, 2.5D, and FCBGA architectures and their mechanical and thermal trade-offs.
- Capacity to comply with federally mandated U.S. export control requirements.
Nice to have
- Knowledge of ASME Y14.5 standards.
- Experience with FEA tools such as ANSYS or Abaqus for structural and thermal analysis.
- Fiber array unit attach, optical connector, or photonic alignment experience.
- Experience with liquid cooling or advanced thermal architectures for AI/HPC systems.
- Exposure to high-volume manufacturing and OSAT engagement in Asia.
Culture & Benefits
- Flexible hybrid workplace model.
- Medical, dental, and vision coverage.
- Retirement savings matching, life insurance, disability coverage, and paid family leave.
- Vacation, sick leave, public holidays, commuter benefits, and training and development.
- Equity grants for full-time employees.
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