Advanced Packaging Senior Engineer

TL;DR

Advanced Packaging Senior Engineer (Semiconductors): Developing and implementing advanced IC package designs from concept to mass production with an accent on multi-chip configurations and complex electrical requirements. Focus on physical layout implementation, optimizing designs for manufacturing, and collaborating with simulation and operations teams to deliver cutting-edge 2.5D/3D packaging solutions.

Location: Bucharest, Romania (Onsite)

Salary: 152,700 - 203,600 RON per annum

Company

hirify.global is a global leader in semiconductor solutions, providing the essential infrastructure for data, cloud, and AI architectures.

What you will do

• Evaluate design feasibility based on package topology, design rules, and electrical requirements.
• Perform hands-on physical implementation of package designs.
• Collaborate with the electrical simulation team to optimize designs for performance.
• Work with operations and fabrication suppliers to ensure design for manufacturing compliance.
• Manage layout-related tasks including tool evaluations, flow development, and library maintenance.

Requirements

• Bachelor’s degree in Electrical Engineering with 3-5 years of experience, or Master’s/PhD with 1-3 years of experience.
• Proficiency with IC package or PCB layout tools such as Cadence APD or Xpedition Package Designer.
• Understanding of advanced 2.5D/3D package technologies including CoWoS, EMIB, CPO, and CPC.
• Experience with flip chip packages and interpreting electrical simulation data like IR Drop and S-parameters.
• Must be eligible to access export-controlled information under U.S. law.
• Good English proficiency (spoken and written).

Culture & Benefits

• Competitive compensation and comprehensive benefits package.
• Environment focused on collaboration, transparency, and inclusivity.
• Access to tools and resources for professional growth and development.
• Opportunity to work on cutting-edge semiconductor technologies and industry-transforming projects.